Semiconductor memory
A technology of memory devices and semiconductors, used in static memory, digital memory information, information storage, etc.
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no. 1 Embodiment
[0062] figure 1 is a block diagram showing the structure of the semiconductor memory device of this embodiment, figure 2 yes means figure 1 A timing chart of the operation of each part in the shown semiconductor memory device. exist figure 1 In block ABn of , the external address Xn is a certain bit of an address for word line selection among addresses supplied from outside the semiconductor memory device.
[0063] Here, the present invention can also be applied to analog SRAM and MSRAM in addition to the above-mentioned general-purpose DRAM. Among them, the semiconductor memory devices of the latter two are compatible with SRAM, so there is no concept of row address and column address in the access address provided from outside the semiconductor memory device. Therefore, when these are used, in the semiconductor memory device of the present invention, an address supplied from the outside is theoretically divided into a row address and a column address.
[0064] Next,...
no. 2 Embodiment
[0099] In this embodiment, a specific example will be described in which the present invention is applied to a form in which the number of stages of decoders differs by a signal decoding system. Image 6 is a block diagram showing the structure of the semiconductor memory device of this embodiment, and figure 1 The same structural elements are marked with the same reference numerals.
[0100] In the figure, the external addresses ADDm and ADDn are some bits of the row address included in the external address. Furthermore, update address generating circuit 3 outputs update addresses RAm, Ran so as to correspond to these external addresses. Moreover, as far as the decoded signal Xn side is concerned, with figure 1 Similarly, an address buffer 1n, an update address buffer 4n, a first address decoder 2n, and a first update address decoder 5n are provided. One of the decoded signals generated by the two decoders is figure 1 The multiplexer 8n having the same structure as the...
no. 3 Embodiment
[0104] In each of the following embodiments after this embodiment, a case where the present invention is applied to a semiconductor memory device having a spare memory cell for defect recovery will be described. The present inventor applies the technical idea of disposing the decoder before the multiplexer in the previous application ((Japanese) Japanese Patent Application No. 2000-63936; filed on March 8, 2002) to a device equipped with a preparatory storage unit. In the semiconductor memory device of the background art, it was found that the first embodiment and the second embodiment also cannot solve the problem.
[0105] For the semiconductor storage device of the background technology equipped with a spare storage unit, in the case of adopting the above-mentioned technical idea, it is considered that Figure 17 Between the shown external address EXT_ADD and the multiplexer 254, and between the update counter 253 and the multiplexer 254, a pre-decoder is configured respe...
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