Semiconductor memory with read amplifier

A sense amplifier and memory technology, applied in the direction of static memory, digital memory information, information storage, etc.

Inactive Publication Date: 2003-07-09
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the closed readout mode itself is sensitive to ground noise or line-to-line nois

Method used

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  • Semiconductor memory with read amplifier
  • Semiconductor memory with read amplifier
  • Semiconductor memory with read amplifier

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0096] figure 1 It is a schematic block diagram showing the overall structure of the semiconductor memory in the embodiment of the present invention.

[0097] refer to figure 1 , the semiconductor integrated circuit device 1 includes: a control signal input terminal 10, which accepts the following control signals, namely column address strobe signal / CAS or row address strobe signal / RAS or write enable signal / WE or output enable signal / OE; Address input terminal 12 receives address signals A1 to An (n: natural number); and input terminal 14 receives and receives input and output data DQ1 to DQi (i: natural number).

[0098] The semiconductor integrated circuit device 1 further includes: a control circuit 20; a memory cell array 30; an address buffer 35; a row decoder 40 and a column decoder 45; a sense amplifier circuit 50; an input-output circuit 60; an input buffer 70; and an output buffer 75 .

[0099] The control circuit 20 controls the overall operation of the semic...

Embodiment 2

[0144] Figure 7 It is a circuit diagram showing the configuration of a sense amplifier and its peripheral circuits in the semiconductor memory in Embodiment 2 of the present invention.

[0145] refer to Figure 7 ,and Figure 4 In contrast, in the semiconductor memory of Embodiment 2, an equalizer 153 is provided instead of the equalizer 151 , and an equalizer 154 is provided instead of the equalizer 152 .

[0146] In the equalizer 153, compared with the equalizer 151, the transistor QN23 for equalization is omitted. In the equalizer 154, compared with the equalizer 152, the transistor QN43 for equalization is removed.

[0147] Since the other circuit configurations are the same as those of the first embodiment, the description thereof will not be repeated.

[0148] The read operation of the semiconductor memory having the above circuit configuration will now be described.

[0149] In addition, the read operation of the semiconductor memory of the second embodiment will ...

Embodiment 3

[0161] Figure 10 It is a circuit diagram showing the configuration of a sense amplifier and its peripheral circuits in the semiconductor memory in Embodiment 3 of the present invention.

[0162] refer to Figure 10 ,and Figure 7 In contrast, in the semiconductor memory device of Embodiment 3, an equalizer 155 is provided instead of the equalizer 153 , and an equalizer 156 is provided instead of the equalizer 154 .

[0163] In the equalizer 155, compared with the equalizer 153, the signal input to the gate of the transistor QN21 is the selection signal SEL2 instead of the precharge signal P1. In addition, the signal input to the gate of the transistor QN22 is the selection signal SEL1 instead of the precharge signal P2.

[0164] Similarly, in the equalizer 156, compared with the equalizer 154, the signal input to the gate of the transistor QN41 is the selection signal SER2 instead of the precharge signal P3. In addition, the signal input to the gate of the transistor QN42...

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Abstract

A sense amplifier is connected to a pair of folded bit lines via selection gates. At the time of reading data in a memory cell connected to the bit line, the pair of folded bit lines enter a floating state. At this time, the selection gate is turned off to disconnect the bit line from a sense node. After that, a potential is supplied to the bit line from an equalizer. Consequently, a semiconductor memory device of the invention can suppress deterioration in charge holding capability of a memory cell and prevent erroneous operation.

Description

(1) Technical field [0001] The present invention relates to a semiconductor memory, and more particularly, to a semiconductor memory having a folded bit line arrangement. (2) Background technology [0002] 15 is a schematic block diagram showing the structure of a memory cell array and its peripheral circuits of a conventional folded bit line semiconductor memory. [0003] The memory cell array 30 includes a plurality of blocks BK0 to BKn. Each block respectively includes: a plurality of folded bit line pairs BL and / BL; a plurality of word lines WL; and a plurality of memory cells MC. Each of the plurality of sense amplifiers 100 is connected to one pair of bit lines BL and / BL. [0004] Referring to FIG. 15, in the folded bit line type semiconductor memory, each sense amplifier 100 is connected to one bit line pair BL and / BL. Therefore, the number of sense amplifiers inside the semiconductor memory can be reduced to about half compared with conventional ones. [0005]...

Claims

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Application Information

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IPC IPC(8): G11C11/409G11C7/18G11C11/401G11C11/4097
CPCG11C7/18G11C11/4097G11C11/4091
Inventor 中冈义人
Owner MITSUBISHI ELECTRIC CORP
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