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Chip transfer method and apparatus

A technology of predetermined positions and components, applied in the identification devices, instruments, semiconductor lasers, etc., can solve problems such as unavailability

Inactive Publication Date: 2004-04-21
IBM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Lasers are currently shifted manually one at a time, making them unusable in any commercially efficient manufacturing process

Method used

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  • Chip transfer method and apparatus
  • Chip transfer method and apparatus
  • Chip transfer method and apparatus

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Embodiment Construction

[0026] Next, various exemplary embodiments of the present invention are described.

[0027] As shown in FIG. 2, a CMOS wafer 2 containing several chips is processed by any existing CMOS process. Therein, the process is stopped after the last metallization step. The chip has landing areas 12 for integrated circuit elements 3 (here VCSELs 3 ). The landing area 12 is now the signal pad for the desired optical input. Then, the entire CMOS wafer 2 is made hydrophobic except for the landing area 12 . It is thus covered with a wettability-structure layer 15 configured such that the landing zone 12 is hydrophilic and the rest of the wettability-structure layer 15 is hydrophobic. The CMOS wafer 2 is also referred to as the target substrate 2 representing the VCSELs 3 of the integrated circuit components 3 . The landing area 12 is a predetermined location 12 for these integrated circuit components 3 . The CMOS wafer 2 is fixed on the target substrate mount 5 .

[0028]As depicted ...

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Abstract

The invention is directed to a method for transferring an integrated-circuit element from a source substrate to a predetermined position on a target substrate. A source substrate with an integrated-circuit element on it and an element transfer holder with a layer of an adhesive material with a controllable adhesivity are provided. The element transfer holder is lowered onto the integrated-circuit element whereby the adhesivity has a first value suited to hold the integrated-circuit element to the element transfer holder. Then the integrated-circuit element is released from the source substrate and the element transfer holder with the integrated-circuit element attached to it is removed from the source substrate. The target substrate is provided with a droplet of a liquid arranged at the predetermined position and the element transfer holder is lowered with the integrated-circuit element attached to it onto the target substrate such that the integrated-circuit element gets into contact with the droplet. Then the adhesivity of the adhesive material is set to a second value suited to release the integrated-circuit element from the element transfer holder whereby the droplet aligns the integrated-circuit element to the predetermined position. Finally the element transfer holder is removed from the integrated-circuit element.

Description

technical field [0001] The present invention relates to a method and apparatus for transferring integrated circuit components from a source substrate to a predetermined position on a target substrate. More particularly, the present invention relates to a method of transferring VCSEL chips or other optical or non-optical components onto silicon substrates on chip-on-chip landing areas. Background technique [0002] Currently, chip-to-chip transfer is going through an important stage of development. TTL-level (TTL-level) transmission can no longer handle the huge amount of data that needs to be transmitted between chips. Several methods for parallel high-speed connections are being developed. With such techniques, it is mechanically feasible to handle significantly higher data rates with a limited number of IC pins. However, a hardware limit of about 1 TB / s is foreseen due to the cost of packages exceeding 1500 pins. Furthermore, signal loss, dispersion, and tolerable chip...

Claims

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Application Information

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IPC IPC(8): G09F9/33G09F9/00H01L21/68H01L21/78H01L25/16H01S5/02H01S5/022
CPCH01L2924/10329H01L24/83H01L2224/83H01L2221/68354H01L2924/01005H01L2221/68359H01L2924/01013H01L2221/68322H01L2221/68368H01L2924/01023H01S5/02272H01L2221/68309H01L2924/30105H01L2924/01065H01L2924/10253H01L21/6835H01L2924/01006H01L2924/01033H01L24/75H01L2924/12042H01L2224/7598H01L2924/14H01L2224/95146Y10T156/1179Y10T156/1911H01L2224/95001H01L2224/80143H01L2224/80004H01L2224/97H01L2224/80006H01L2224/95136H01L2224/83002H01L2224/83143H01S5/0237H01L2924/00H01L2224/80001
Inventor 托马斯·莫夫
Owner IBM CORP
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