Semiconductor luminescent device and its manufacturing method

A technology for light-emitting devices and manufacturing methods, applied in semiconductor devices, electric solid-state devices, electrical components, etc., can solve problems such as affecting reliability, and achieve the effect of preventing the deterioration of processability and excellent thermal radiation performance.

Inactive Publication Date: 2004-08-04
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

While this is advantageous in terms of thermal radiation, heat from the soldering process will easily transfer to the LED device, negatively affecting reliability
[0013] When a metal having higher thermal conductivity than resin is used as the base as in Conventional Examples 3, 4, and 5, heat during soldering may negatively affect reliability as in the case above

Method used

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  • Semiconductor luminescent device and its manufacturing method
  • Semiconductor luminescent device and its manufacturing method
  • Semiconductor luminescent device and its manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0037] figure 1 It is a cross-sectional view of the surface-mounted LED according to the first embodiment of the present invention.

[0038] The semiconductor light emitting device of the first embodiment includes: an LED chip 4; a first lead frame 1 on which the LED chip 4 is mounted; and a second lead frame 2 which is electrically connected to the LED chip by a bonding wire 5 such as a gold wire 4; Resin part 3, which surrounds the LED chip 4 and fixes the lead frame. The metal body 8 is located under the area where the LED chip 4 is mounted on the first lead frame 1.

[0039] The first lead frame 1 and the second lead frame 2 are embedded in the resin part 3 by insert molding. The LED chip 4 is mounted on the first lead frame 1 with the Ag paste 7 in between. The bonding wire 5 is connected to the second lead frame 2. Therefore, the second lead frame 2 is mechanically and electrically connected to the LED chip 4. The resin portion 3 is formed to surround the periphery of the LE...

no. 2 example

[0049] figure 2 It is a cross-sectional view of a surface-mounted LED according to the second embodiment of the present invention.

[0050] The semiconductor light emitting device of the second embodiment is an improvement of the semiconductor light emitting device of the first embodiment. The metal body 8 is in contact with the first lead frame 1.

[0051] For example, the first lead frame 1 mounted with the LED chip 4 is set lower than the second lead frame 2 so that contact with the metal body 8 is established. in figure 2 In the example shown, the first lead frame 1 is bent to form contact with the metal body 8.

[0052] Therefore, the heat generated by the LED chip 4 is sequentially transferred through the first lead frame 1, the metal body 8, and the mounting board. There is no gap between the first lead frame 1 and the metal body 8 in the first embodiment, so that the heat generated at the LED chip 4 is more effectively transferred to the mounting board. Although the fir...

no. 3 example

[0055] image 3 It is a cross-sectional view of a surface-mounted LED according to the third embodiment of the present invention.

[0056] The semiconductor light emitting device of the third embodiment is another improvement of the semiconductor light emitting device of the first embodiment. On the surface of the metal body 8 is provided an electrical insulation treatment portion 9 formed, for example, by applying an insulating film, an insulating coating, or by anodizing. The surface of the insulating metal body 8 is in contact with the first lead frame 1 and the second lead frame 2.

[0057] In the semiconductor light emitting device of the second embodiment, whether a single LED chip or multiple LED chips are used, as long as the LED chips are located on the same lead frame, the heat generated by the LED chip 4 can be transferred to the mounting board, and the first lead There is no part corresponding to the gap in the first embodiment between the frame 1 and the metal body 8...

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Abstract

A semiconductor light emitting device includes an LED chip (4), a first lead frame (1) on which the LED chip (4) is mounted, a second lead frame (2) electrically connected to the LED chip (4) via a bonding wire (5), and a resin portion (3) surrounding the circumference of the LED chip (4), and fastening the first and second lead frames (1, 2). A metal body (8) is located under the region of the first lead frame (1) where the LED chip (4) is mounted.

Description

Technical field [0001] The present invention relates to a semiconductor light emitting device and a manufacturing method thereof, and more particularly to a semiconductor light emitting device using light emitting elements such as a light emitting diode (LED) and a manufacturing method thereof. Background technique [0002] Figure 8 An example of a conventional semiconductor light emitting device is shown. [0003] Please see Figure 8 , The resin part 3 is formed by insert molding in a manner of fastening the first lead frame 1 and the second lead frame 2. The LED chip 4 is mounted on the first lead frame 1 with Ag paste 7. The bonding wire 5 is connected to the second lead frame 2. The LED chip 4 is surrounded by epoxy resin 6 to be protected and sealed. [0004] The following will explain Figure 8 The manufacturing method of the semiconductor light emitting device shown. [0005] The first lead frame 1 and the second lead frame 2 are formed in a predetermined pattern config...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/56H01L33/60H01L33/62H01L33/64
CPCH01L33/647H01L33/642H01L2224/48091H01L2224/73265H01L2224/45144H01L2924/00014H01L2924/00
Inventor 竹中靖二
Owner SHARP KK
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