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Method for preparing composite material capable of forming in situ conductive microfiber network

A technology of composite materials and conductive fillers, which is applied to conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problems of reduced processing performance and mechanical properties, and achieve the effects of low requirements, easy control and low investment.

Inactive Publication Date: 2004-09-15
SICHUAN UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Because when the content of conductive filler is low, the composite is not conductive, and when the content of filler is high, although the composite is conductive, the processability and mechanical properties are greatly reduced.

Method used

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  • Method for preparing composite material capable of forming in situ conductive microfiber network
  • Method for preparing composite material capable of forming in situ conductive microfiber network
  • Method for preparing composite material capable of forming in situ conductive microfiber network

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Experimental program
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Embodiment 1～22

[0037] (1) Drying: Dry the low-melting-point thermoplastics, high-melting-point thermoplastics, and conductive fillers at 70-140°C for 8-24 hours according to the proportions given in Table 1, and control the moisture content to <0.01%;

[0038] (2) Melt mixing Put the dried and cooled high-melting point thermoplastic and conductive filler into an open mixer or internal mixer according to the ratio, and melt and mix at a temperature of 200-290°C for 5-25 minutes to prepare a masterbatch;

[0039] (3) Crushing: cooling and crushing the masterbatch obtained by melting and mixing into fine particles with a particle size of 1 to 5 mm;

[0040] (4) Drying Dry the masterbatch obtained after crushing at 70-140°C for 8-16 hours, and control the moisture content to <0.01%;

[0041] (5) Melt mixing extrusion Put the crushed and dried masterbatch and low-melting point thermoplastics in proportion to melt, mix and extrude in an extruder. The extrusion temperature is 175-295°C, and the die...

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Abstract

The invention discloses a manufacturing method of a kind of compound material which can forms in situ conductive fibre network. The weight shares are 70-95 shares of low melting point thermal plasticity plastics, 5-30 shares of high melting point thermal plasticity plastic, and 7.5-30 shares of conductive fillers in each 100 shares of above two plastic, the process is drying, masterbatch producing, fusing and mixing, thermal extension, cooling, prilling. The conductive fillers in the invention are in the fibre phase of high melting point, these fibre phases can form the conductive network in product. Thus, the fillers are reduced and the conductive prolonged penetrating value, but doesn't affect the workability and mechanical performance of the compound, reversely, the in situ fibre has a certain enhancing effect to the compound. The method is simple.

Description

1. Technical field [0001] The invention belongs to the technical field of preparation of conductive polymer materials, and in particular relates to a preparation method of a composite material capable of forming an in-situ conductive microfiber network. 2. Background technology [0002] The bulk resistivity of most polymer materials is very high, about 10 10 ~10 20 Between Ω·cm, when used as an electrical insulating material, its performance is very good. However, with the advancement of science and technology, especially the development of electronic industry, information technology and other fields, people's demand for the conductivity of polymer materials is increasing, and it is becoming more and more urgent. Conductive polymer materials are used in this context. should be born. According to different raw materials and preparation methods, conductive polymer materials can be divided into two categories: structural type and composite type. Structural conductive polyme...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K5/101C08L23/02C08L25/06C08L27/06C08L69/00H01B1/20
Inventor 李忠明许向彬杨鸣波黄锐谢长琼
Owner SICHUAN UNIV
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