Surface-mounting high frequency modular

A surface-mounted, high-frequency module technology, applied in high-frequency matching devices, circuit devices, printed circuits, etc., can solve problems that hinder the miniaturization of high-frequency modules

Inactive Publication Date: 2004-10-27
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0017] In addition, when resin sealing is performed intentionally, in order to prevent the sealing resin 43 from flowing into the end-face through-hole 44, the distance L between the BGA package IC 41 and the end-face through-hole 44 must be widened.

Method used

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  • Surface-mounting high frequency modular
  • Surface-mounting high frequency modular
  • Surface-mounting high frequency modular

Examples

Experimental program
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Embodiment Construction

[0028] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0029] figure 1 Shown is a cross-sectional view of the surface-mounted high-frequency module 10 of the present invention.

[0030] The surface-mounted high-frequency module 10 of this embodiment is such as figure 1 Shown is a multilayer substrate with a BGA package IC1 and a printed circuit board on which the BGA package IC1 is mounted, and a multilayer substrate in which an inner layer composed of a core material 6 and an outer layer composed of a combination layer 5 constituting the outer layer of the inner layer are laminated as the Surface mount high frequency module of printed circuit board. In addition, the upper surface of the printed circuit board (core material 6) on which the mounting portion of the BGA package IC1 is mounted is formed lower than the upper surface of the outer layer (combined layer 5).

[0031] In addition, a soldering pad 7 for electrically conn...

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PUM

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Abstract

A surface-mount-type high-frequency module in accordance with the present invention comprises BGA package IC(s) 1 and printed circuit board(s) carrying such BGA package IC(s) 1; such printed circuit board(s) being multilayer board(s), laminated at which there are inner layer(s) comprising core material(s) 6, and outer layer(s) constituting exterior(s) relative to inner layer(s) and comprising build-up layer(s) 5. Top surface(s) of printed circuit board(s) (core material(s) 6), in region(s) where BGA package IC(s) 1 carried thereby is / are mounted, is / are formed so as to be lower than top surface(s) of outer layer(s) (build-up layer(s) 5). Gap(s) between core material(s) 6 and BGA package IC(s) 1 is / are filled with encapsulant resin(s) 3.

Description

Technical field [0001] The present invention relates to a surface-mounted high-frequency component having a printed substrate on which a BGA (Ball Grid Array) package IC is mounted. Background technique [0002] Up to now, in electronic devices such as mobile phones, PDAs, and notebook computers equipped with high-frequency modules used as wireless communication devices, there has been an increasing demand for miniaturization (requirements for lightness and thinness). Therefore, in recent years, the high-frequency modules used in these electronic devices are mainly surface-mountable modules as the mainstream. [0003] figure 2 Shown is a perspective view of a conventional surface-mounted high-frequency module. In this surface-mounted high-frequency module, in order to suppress unnecessary radiation waves from the surface-mounted high-frequency module body, a shield cover (not shown) is sometimes installed. [0004] As a means of surface-mounting the surface-mount type high-freq...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/12H01L25/04H01L25/18H05K1/02H05K1/18H05K3/28H05K3/40H05K9/00
CPCH05K3/403H05K1/183H05K3/284H05K1/0237H05K2201/10734H05K9/0022H01L2224/16225H01L2224/32225H01L2224/73204H01L2924/00014H01L2924/00H01L2224/0401
Inventor 小坂优
Owner SHARP KK
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