Surface-mounting high frequency modular

Abstract

A surface-mount-type high-frequency module in accordance with the present invention comprises BGA package IC(s) 1 and printed circuit board(s) carrying such BGA package IC(s) 1; such printed circuit board(s) being multilayer board(s), laminated at which there are inner layer(s) comprising core material(s) 6, and outer layer(s) constituting exterior(s) relative to inner layer(s) and comprising build-up layer(s) 5. Top surface(s) of printed circuit board(s) (core material(s) 6), in region(s) where BGA package IC(s) 1 carried thereby is / are mounted, is / are formed so as to be lower than top surface(s) of outer layer(s) (build-up layer(s) 5). Gap(s) between core material(s) 6 and BGA package IC(s) 1 is / are filled with encapsulant resin(s) 3.

Description

Technical field [0001] The present invention relates to a surface-mounted high-frequency component having a printed substrate on which a BGA (Ball Grid Array) package IC is mounted. Background technique [0002] Up to now, in electronic devices such as mobile phones, PDAs, and notebook computers equipped with high-frequency modules used as wireless communication devices, there has been an increasing demand for miniaturization (requirements for lightness and thinness). Therefore, in recent years, the high-frequency modules used in these electronic devices are mainly surface-mountable modules as the mainstream. [0003] figure 2 Shown is a perspective view of a conventional surface-mounted high-frequency module. In this surface-mounted high-frequency module, in order to suppress unnecessary radiation waves from the surface-mounted high-frequency module body, a shield cover (not shown) is sometimes installed. [0004] As a means of surface-mounting the surface-mount type high-freq...

AI Technical Summary

Problems solved by technology

[0017] In addition, when resin sealing is performed intentionally, in order to prevent the sealing resin 43 from flowing into the end-face through-hole 44, the distance L between the BGA package IC 41 and the end-face through-hole 44 must be widened.

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