Method and apapratus for temperature circulation control
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- DALIAN UNIV OF TECH
- Publication Date
- 2004-11-24
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The temperature cycle control method and device of the invention belong to the field of temperature control, and relate to a temperature control method and device using a semiconductor thermoelectric cooling device. Background technique
[0002] In the manufacturing process of plastic microfluidic chips, the thermocompression forming of the microchannels on the plastic chip and the bonding of the substrate and the cover sheet require not only pressure control, but also temperature cycle control. At present, electric heaters are usually used for temperature rise control and circulating water cooling for temperature drop control. The delay time is long, the response is slow, and it is impossible to accurately control according to the required temperature rise and fall curves, which affects the quality and stability of the chips produced.
[0003] The semiconductor thermoelectric cooling device is based on the Peltier effect. It is composed of P-type and ...