Method and apapratus for temperature circulation control

Abstract

The present invention relates to temperature control. The temperature control method is to adopt electric heater or circular water cooler to control temperature of heat accumulating oil tank, to adopt thermocouple temperature sensor to detect temperature of heat accumulating oil tank and to control temperature of temperature controlling board circularly. Altering the direction of current in semiconductor thermoelectric refrigerating device can realize heating or cooling of the temperature controlling board. The circular temperature controlling device consists of electric heater, heat accumulating oil tank, circular water cooler and thermocouple, and may have also heat conducting temperature controlling board, semiconductor thermoelectric refrigerating device, platinum resistive temperature sensor, heat conducting silicon resin rubber and heat isolating material. The present invention can lower power consumption, save power, control temperature fast and precisely.

Description

technical field [0001] The temperature cycle control method and device of the invention belong to the field of temperature control, and relate to a temperature control method and device using a semiconductor thermoelectric cooling device. Background technique [0002] In the manufacturing process of plastic microfluidic chips, the thermocompression forming of the microchannels on the plastic chip and the bonding of the substrate and the cover sheet require not only pressure control, but also temperature cycle control. At present, electric heaters are usually used for temperature rise control and circulating water cooling for temperature drop control. The delay time is long, the response is slow, and it is impossible to accurately control according to the required temperature rise and fall curves, which affects the quality and stability of the chips produced. [0003] The semiconductor thermoelectric cooling device is based on the Peltier effect. It is composed of P-type and ...

AI Technical Summary

Problems solved by technology

Since the cooling power of the semiconductor thermoelectric cooling device depends on the temperature difference between its two sides, this invention only uses fans for heat dissipation and cooling, and cannot accurately and quickly control the heating and cooling process

The existing temperature cycle control methods and devices mainly suffer from slow response and overshooting, and cannot accurately and quickly control the heating and cooling process. At the same time, the loss of power during the heating and cooling process is large and the efficiency is low.

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