Device and method for nondestructive inspection on semiconductor device

An inspection method and inspection device technology, applied in semiconductor/solid-state device testing/measurement, electrical components, non-contact circuit testing, etc.
CN1571136AInactive Publication Date: 2005-01-26NEC ELECTRONICS CORP
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
NEC ELECTRONICS CORP
Publication Date
2005-01-26
Estimated Expiration
Not applicable Β· inactive patent

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Abstract

A nondestructive inspection device (or method) is basically configured such that a laser beam (1300 nm) (3, 53) is irradiated on a surface (or back) of a semiconductor device chip (4) to scan. Due to irradiation of the laser beam, a defect position is heated to cause a thermoelectromotive current, which induces a magnetic field. A magnetic field detector (5) such as SQUID (55) detects a strength of the magnetic field, based on which a scan magnetic field image is produced. A display device (7) superimposes the scan magnetic field image on a scan laser microphotograph on a screen, so it is possible to perform defect inspection on the semiconductor device chip. Incidentally, a semiconductor device wafer (40) is constructed to include a thermoelectromotive force generator (21) and its wires (20a).
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Description

technical field

[0001] The present invention relates to apparatus and methods for non-destructive inspection of chips of semiconductor devices, and in particular to non-destructive inspection for detecting electrically active defects. The present invention also relates to a semiconductor device suitable for non-destructive inspection, and a method of manufacturing the semiconductor device.

[0002] This application is based on Patent Application Hei 10-272788, Patent Application Hei 11-67744 and Patent Application Hei 11-133283 filed in Japan, the contents of which are incorporated herein. Background technique

[0003] Usual non-destructive inspection techniques are known from papers such as the title "Thermal Electromotive Force-Based OBIC Analysis Technique", which was presented as material for the 132 meeting of the Japan Research Institute Promotion Fund 132 Committee on Research Aspects, Involving Charged Particles industrial applications. Here, "OBIC" is an abbreviat...

Claims

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