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Processing method and processing apparatus

A processing method and processing device technology, applied in the direction of metal processing equipment, metal processing machine parts, manufacturing tools, etc., can solve the problem that the processing productivity cannot be expected to be improved

Active Publication Date: 2005-05-04
HITACHI SEIKO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When such a measurement is performed, it is not possible to expect an increase in processing productivity due to the measurement steps

Method used

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  • Processing method and processing apparatus
  • Processing method and processing apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0085] Example 1: In the case where the board top arrival time (Board Top Arrival Time) Ta of the drill 4 > the stabilization time Ts.

[0086] In the related art, the drill descends at a speed Vz, such as image 3 shown by the dotted line. On the other hand, according to the present invention, the drill 4 moves downward at a velocity Vz1 (Vz1>Vz) obtained from Equation 2 below, as image 3 shown by the solid line.

[0087] Vz1≥La / Ts Equation 2

[0088] Therefore, processing productivity can be improved.

[0089] By the way, assuming that the image 3 , there is no response delay on the Z-axis drive mechanism 6. However, in fact, there is also a response delay on the Z-axis driving mechanism 6 . Therefore, as shown in FIG. 4, the optimal Z-axis descending timing t is calculated by adding the delay time Td to the moving time Ta obtained in step 7, and the drill moves downward at the calculated timing t. Therefore, machining productivity can be improved without reducing m...

Embodiment 2

[0092] Embodiment 2: In the case of requiring machining accuracy.

[0093] When high machining accuracy is required, the allowable stable range is narrowed in advance, such as Image 6 shown by the solid line in . Then, the stabilization time Ts is observed in this state. Therefore, while the machining accuracy is improved, the machining productivity can be improved.

[0094] On the contrary, when the processing accuracy does not need to be so high, widen the allowable stable range in advance, such as Image 6 shown by the dotted line in . Thus, processing productivity can be improved.

[0095] Conventionally, the time when the drill 4 is disengaged from the plate is not taken into account. However, when the X-axis driving mechanism 3 and the Y-axis driving mechanism 7 are operated once the drill 4 is disengaged from the board, machining productivity can be improved.

[0096] In this embodiment, when the settling time Ts calculated in step 2 and the magnitude of the over...

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Abstract

The present invention provides a processing method and its processing equipment for raising processing production rate and processing quality. It is characterized by that before processing, according to the predefined checking condition NC control mechanism can make X-axis drive mechanism move working table, so that NC control mechanism can obtain the stable time required from the instruction reached time of positioning instruction to that the working table position response is stable in the predefined allowably range, in the same way, for the mechanism for moving drill on Y-axis direction NC control mechanism can obtain the stable time required until the position response is stabilized in the predefined allowable range. When processing, if the stable time is obtained, the drill can be moved on Z-axis direction, and can be cut into printed circuit board.

Description

technical field [0001] The invention relates to a processing method and a processing device. In the method and device, the worktable on which the workpiece is placed and the spindle for holding the tool move relative to each other in X-, Y- and Z-directions perpendicular to each other to process with the tool artifact. Background technique [0002] Figure 8 It is a structural diagram of a traditionally used printed circuit board processing device. exist Figure 8 In, the printed wiring board 1 is fixed on the workbench 2 with the backing plate 9 . The table 2 is driven by the X-axis drive mechanism 3 to be able to move as desired in the front / rear (X) direction. The main shaft 5 holding the drill 4 is driven by the Z-axis driving mechanism 6 to move as desired in the up and down (Z) direction. The Z-axis drive mechanism 6 is driven by the Y-axis drive mechanism 7 to be desirably movable in the left and right (Y) directions. Each of the X-, Y- and Z-axis drive mechanisms...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23B39/14B23Q1/26
Inventor 渡边一雄山下孝彦伊藤靖长泽胜浩
Owner HITACHI SEIKO LTD
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