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Process for manufacturing a wiring substrate

A wiring substrate and insulating resin technology, which is applied in the fields of printed circuit manufacturing, multilayer circuit manufacturing, and improvement of metal adhesion of insulating substrates. It can solve problems such as insufficient adhesion of insulating resin layers, achieve firm adhesion, and reduce impact effects.

Inactive Publication Date: 2005-05-25
NGK SPARK PLUG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, when the radius of the blind via conductor forming the fine-pitch wiring layer or connecting the upper-layer wiring layer and the lower-layer wiring layer is reduced, the existing insulating resin layer and its surface roughening may make the fine-pitch Insufficient adhesion between the wiring layer and its adjacent insulating resin layer

Method used

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  • Process for manufacturing a wiring substrate
  • Process for manufacturing a wiring substrate
  • Process for manufacturing a wiring substrate

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Embodiment Construction

[0034] The best mode of the present invention will be described below, but the present invention is not limited thereto.

[0035] figure 1 is a cross-sectional view showing a center substrate made of bismaleimide triazine (BT) resin with a thickness of about 0.7 mm. Copper foils 4 and 5 with a thickness of 70 μm are respectively covered on the surface 2 and the back 3 of the central substrate 1 . An unillustrated photosensitive / insulating dry film is formed on the copper foils 4 and 5, and exposure and developing operations are performed on the dry film according to a predetermined pattern. Thereafter, the obtained resist is removed with a stripping solution (according to well-known removal methods).

[0036] Here, a multi-layer board with a plurality of central substrates 1 each subject to similar processing steps (like the following steps) can be used.

[0037] results, such as figure 2 As shown, copper foils 4 and 5 become wiring layers 4 and 5 in the aforementioned pa...

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Abstract

A manufacturing method for a wiring substrate, comprising: a roughening step of roughening an insulating resin layer, at least one insulating resin layer containing an epoxy resin containing 30 to 50% by weight of an average particle diameter of 1.0 to 10.0 μm inorganic filler SiO2, wherein the roughening step includes immersion in a permanganate solution at 70 to 85°C for 20 minutes or longer.

Description

technical field [0001] The present invention relates to a method of manufacturing a wiring substrate capable of reliably bonding a fine-pitch wiring layer (for example, a build-up wiring layer) to an insulating resin layer adjacent thereto. Background technique [0002] According to the trend of high performance and high signal processing rate in recent years, it is urgently required to make smaller-sized wiring substrates and finer-pitch wiring layers (for example, build-up wiring layers). [0003] For example: the insulating resin layer between one wiring layer and two adjacent wiring layers is usually limited to a 25 μm x 25 μm length x width actual section. However, it is required that the length and width are equal to or less than 20 μm, respectively. [0004] In order to meet the above requirements, it is necessary not only to improve the accuracy of the shape and size of the wiring layer, but also to make the adhesion between the wiring layer and its adjacent insulat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/38H05K3/46
CPCH05K3/381H05K3/4661H05K2201/0209H05K2203/0796Y10T29/49155Y10T29/49165
Inventor 齐木一杉本笃彦
Owner NGK SPARK PLUG CO LTD
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