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Electroconductive composite and its producing method

A manufacturing method and composition technology, which is applied in the field of conductive composition and its manufacture, can solve the problems of high cost and achieve the effect of reducing resistivity and suppressing excessive heating

Inactive Publication Date: 2005-06-22
ALPS ALPINE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the entire electrode pattern is formed with the above-mentioned metal particles, there will be a problem of high cost.

Method used

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  • Electroconductive composite and its producing method
  • Electroconductive composite and its producing method
  • Electroconductive composite and its producing method

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Embodiment Construction

[0023] figure 1 is a filling structure diagram showing the state before the conductive composition of the present invention hardens, figure 2 It is a filling structure diagram showing the state of the conductive composition of the present invention after curing. image 3 It is a perspective view showing a circuit board. However, although figure 1 and figure 2 Each represents a regular arrangement state as explained, but is actually not limited to this state.

[0024] Such as figure 1 As shown, the conductive composition 1 of the present invention contains a conductive material 2 and another conductive material 3 smaller than the aforementioned conductive material in a specific binder resin 10 . The above-mentioned conductive materials 2 and 3 are respectively in the form of particles, and the average particle diameter of the conductive material 2 is formed to be much larger than the average particle diameter of the conductive material 3 . For example, when figure 1 As...

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Abstract

The present invention provides a conductive composition capable of forming fine electrode patterns. In a predetermined binder resin (10), a conductive material (2) and a conductive material (3) having a particle diameter smaller than the conductive material (2) are contained, and the binder resin (10) also contains a An additive (4) of metal nanoparticles finer than the above-mentioned conductive material (3). The metal nanoparticles are filled in the gap 5 formed by the conductive material (2) and the conductive material (3), and when heated and hardened, the metal nanoparticles increase or precipitate, increasing the strength of the conductive materials (2), (3). The metal filling rate in the void (5) formed by each particle can be reduced, thereby reducing the resistivity.

Description

technical field [0001] The present invention relates to a conductive composition for forming conductive layers such as electrodes on substrates of various electronic components and a method for producing the same, and particularly relates to a conductive composition capable of lowering resistivity and a method for producing the same. Background technique [0002] As circuit boards mounted on electronic devices, etc., electrode patterns are formed by etching, or electrode patterns are formed by printing. [0003] The invention described in Patent Document 1 below relates to an electrode ink for electronic components in which an electrode pattern is formed by printing. The electrode ink is obtained by dispersing various metal powders with different diameters below 10 μm in water or an organic solvent in a predetermined amount. [0004] In addition, Patent Document 2 below describes a conductive paste used as an electrode pattern of a circuit board. The conductive paste is fo...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01B1/00H01B13/00
Inventor 竹森悟
Owner ALPS ALPINE CO LTD
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