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Method and device for treating flat objects in through type treating apparatus

A technology for processing equipment and objects. It is used in printed circuit liquid handling, electrical components, and printed circuit manufacturing. It can solve problems such as helplessness and inability to function due to pressure differences.

Inactive Publication Date: 2005-07-13
HOLLMULLER MASCHENBAU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For blind holes, Bernoulli's theorem does not help the exchange of matter, because the pressure difference on the two sides of the object cannot play a role

Method used

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  • Method and device for treating flat objects in through type treating apparatus
  • Method and device for treating flat objects in through type treating apparatus
  • Method and device for treating flat objects in through type treating apparatus

Examples

Experimental program
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Embodiment Construction

[0019] figure 1 , a driven transport roller 2 with an axis 4 transports the objects 1 to be processed in a transport direction 3 . More and more thin and very thin objects are also treated wet-chemically and / or electrolytically. In circuit board technology, the thickness d of the conductive film is 50 μm or less. If the core of the circuit film is made of polyamide, for example, it can be particularly flexible and sensitive on the surface. This makes conveying through wet chemical pass-through processing plants significantly more difficult. Due to the electrolyte flow the circuit membrane can deflect out of the delivery track and cause a delivery blockage. According to the invention, a reliable conveying of the circuit film is made possible by guiding the object 1 in the conveying plane 17 . This is achieved by the same size of the first electrolyte flow 8 directed at the surface of the object mirror-symmetrically on the upper side 6 and the lower side 7 of the conveying ...

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Abstract

The invention relates to the conveying and processing of circuit boards and circuit films in pass-through processing plants with horizontal conveying by means of conveying rollers. According to the prior art, the required transport reliability for thin circuit films no longer exists if circuit boards are to be produced in the same plant without retrofitting. According to the invention, the required delivery reliability is achieved by the electrolyte flow (8) directed mirror-symmetrically to the object (1) in the delivery direction (3). In order to increase the mass exchange in the holes, when the circuit board has blind holes, an additional flow of electrolyte (11) flows mirror-symmetrically and nearly vertically towards the object (1). In order to form an additional through-flow through the through-opening, a difference in the static pressure of the electrolyte is produced on both sides of the body according to Bernoulli's law. Especially for electrolysis equipment with pass-through treatment. A "pipe-in-pipe" structure is selected for the spray pipe of the electrolyte flow (8, 11) to achieve a larger effective device length while keeping the total length of the device constant.

Description

technical field [0001] The invention relates to a method and a device for conveying and processing flat objects with horizontal conveying in a pass-through processing plant. The invention is preferably used for the wet-chemical and electrolytic treatment of circuit boards and circuit films (chips). In circuit board technology, the treatment involves, for example, cleaning and etching of surfaces, removal of drilling chips from holes, through-plating of holes, electrolytic reinforcement of electrically conductive layers and structures, development of conductor lines, Stripping and etching, and oxidation and reduction of the surface and other treatments. The circuit board and circuit film are conveyed through the pass-through processing equipment with conveying rollers and touch rollers. It is important here that a strong exchange of substances takes place even in the small pores of the body. This is achieved by utilizing the incident flow of electrolyte against the surface. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/18C25D5/08C25D7/06H05K3/00
CPCC25D5/08C25D7/0621C25D7/0685H05K3/0085H05K3/0088H05K2203/0746H05K2203/1509
Inventor T·科西科夫斯基
Owner HOLLMULLER MASCHENBAU