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Low melting point tin-zinc solder without lead and soldering paste

A lead-free solder alloy, low melting point technology, applied in the direction of welding/cutting medium/material, welding medium, welding equipment, etc., can solve the problems of not reaching Sn-Pb solder, deterioration, etc., to improve oxidation resistance, reduce The requirements of smelting equipment and the effect of simple smelting process

Inactive Publication Date: 2005-07-27
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Compared with binary Sn-Zn alloys, the wettability of these alloys has been improved to a certain extent, but it is still not up to the level of Sn-Pb solder or other properties are significantly deteriorated with the increase of alloying elements, and the soldering process is often Requires shielding gas or activated flux

Method used

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  • Low melting point tin-zinc solder without lead and soldering paste
  • Low melting point tin-zinc solder without lead and soldering paste
  • Low melting point tin-zinc solder without lead and soldering paste

Examples

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Embodiment 1

[0017] A low-melting-point tin-zinc lead-free solder alloy is composed of Zn, Bi, Nd and Sn, wherein the weight percentage content of Zn is 5-9%, the weight percentage content of Bi is 0.5-4%, and the weight percentage content of Nd is 0.01 to 0.5%, and the rest is Sn.

Embodiment 2

[0019] A low-melting-point tin-zinc lead-free solder alloy is composed of Zn, Bi, Nd and Sn, and its proportion is: 6-9% by weight of Zn; 2-4% by weight of Bi; 0.05-0.5% by weight of Nd, and the rest for Sn.

Embodiment 3

[0021] A low-melting-point tin-zinc lead-free solder alloy is composed of Zn, Bi, Nd and Sn, and its proportion is: Zn containing 6-8% by weight; Bi 2-3.5% by weight; 0.05-0.2% Nd by weight, and the rest for Sn.

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Abstract

A low-smelting-point non-lead SnZn-alloy solder is prepared from Zn (5-9 wt.%), Bi (0.5-4), Nd (0.01-0.5) and Sn (rest). Its solder paste features that the Sn or Sn-alloy particles are coated on the surface of each solder particle for high stability and high antioxidizing power.

Description

technical field [0001] The invention relates to a general-purpose lead-free solder used for soldering and surface packaging of electronic components, in particular to a low-melting-point tin-zinc lead-free solder alloy and its solder paste. Background technique [0002] In the electronics industry, traditional solders are based on tin-lead (Sn-Pb) alloys. The rapid development of electronics and information industries has led to a sharp increase in electronic waste. The large amount of lead produced by the decomposition of these electronic wastes directly threatens human health. Countries around the world are considering legislation to restrict the use of this element in electronic products. At present, my country has no legislation to restrict the use of lead, but as a major producer of various electronic products that consume electronic solder, the development of new high-performance lead-free environmentally friendly solder is an important ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26C22C13/00
Inventor 孙扬善周健薛烽
Owner SOUTHEAST UNIV
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