Method for mfg wired substrate and method for mfg electronic apparatus
A wiring substrate and substrate technology, which is applied in the fields of printed circuit manufacturing, electrical component assembly printed circuit, semiconductor/solid-state device manufacturing, etc., can solve the problem of multiple manufacturing steps, resource and material consumption, and dependence on photosensitive resist for wiring dimensional accuracy Layer definition and other issues, to achieve low cost, reduce material waste, and reduce waste
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no. 1 example
[0054] figure 1 (A)~ Figure 5 (B) is an explanatory diagram of a method of manufacturing a wiring substrate according to the first embodiment of the present invention. In this embodiment, an electroless gold plating process is applied to manufacture the wiring substrate.
[0055] first case
[0056] figure 1 (A)~ Figure 4 (B) is an explanatory diagram of the first example of this embodiment. figure 1 (A)~ figure 2 (B) is an explanatory diagram of each step of the electroless gold plating process, image 3 (A)~ Figure 4 (B) is a schematic diagram of the substrate in various steps of the electroless gold plating process.
[0057] The substrate (thin plate) 10 may be a flexible substrate. As the flexible substrate, an FPC (Flexible Printed Circuit), a COF (Chip On Film) substrate, or a TAB (Tape Automated Bonding) substrate can be used. The substrate 10 may be formed of an organic material such as resin. As the substrate 10, a polyimide substrate or a polyester subst...
no. 2 example
[0080] Figure 6 (A)~ Figure 10 (B) is an explanatory diagram of a method of manufacturing a wiring substrate according to the second embodiment of the present invention. In this embodiment, the surfactant is patterned by using a liquid jet method.
[0081] first case
[0082] Figure 6 (A)~ Figure 7 (B) is an explanatory diagram of each step of the electroless gold plating process. Figure 8 (A)~ Figure 9 (B) is a schematic diagram of the substrate in each step of the electroless gold plating process.
[0083] Such as Figure 8 As shown in (A), as the substrate 10, the surface potential thereof is set to a negative potential in advance. Such as Figure 6 As shown in (A), alkaline cleaning can be performed by immersing the substrate 10 in an alkaline solution (for example, an inorganic alkaline solution) 62 . Thus, if Figure 8 As shown in (B), the uneven potential on the surface of the first region 12 and the second region 14 of the substrate 10 can be changed t...
no. 3 example
[0095] Figure 11 is a schematic diagram for explaining a method of manufacturing an electronic device according to a third embodiment of the present invention, specifically showing an example of an electronic device having a wiring substrate.
[0096] A metal layer having a predetermined pattern shape is formed on the wiring substrate 1 (in Figure 11 omitted). A semiconductor chip 80 having an integrated circuit can be mounted (for example, flip-chip) on the wiring substrate 1 . The semiconductor chip 80 (integrated circuit) is electrically connected to the metal layer. In this way, the semiconductor device 3 including the semiconductor chip 80 and the wiring substrate 1 can be manufactured. Then, wiring substrate 1 (or semiconductor device 3 ) is electrically connected to circuit board 82 . Thus, an electronic device can be manufactured. In addition, the wiring substrate 1 can also be as Figure 11 bend as indicated by the arrow.
[0097] When the circuit board 82 is...
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Abstract
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