Electronic apparatus having liquid cooling system therein

Abstract

An objective of the invention is to provide electronic equipment, having a liquid-cooled system that does not require replenishing of liquid coolant, will not obstruct the task of assembling the equipment and for maintaining, and enables cooling operation. In the liquid-cooled system, a CPU 200 requiring cooling is mounted in a case 100 for cooling. The liquid-cooled system comprises a cooling jacket 50, a radiator 60, and a circulation pump 70. In this case, piping for circulating a liquid coolant to the cooling jacket is composed of metal pipes. The piping is spirally formed so that the piping will not obstruct the task of assembling the equipment and of maintenance; or bellows are formed at a midpoint position in the piping for enabling free arrangement in the case.

Description

technical field [0001] The present invention relates to an electronic device such as a personal computer called a desktop and / or notebook type, and a server, and particularly relates to an electronic device having a liquid cooling system, which can be loaded inside the electronic device. The semiconductor integrated circuit element as a heat generating element is efficiently cooled by liquid refrigerant. Background technique [0002] On electronic devices such as desktop and / or notebook personal computers and servers, semiconductor integrated circuit components as heating elements, especially heating elements represented by CPUs (Central Processing Units), are usually guaranteed Its normal action requires cooling. Therefore, conventionally, the cooling is generally realized by integrally forming a heat transfer body called a heat sink called a heat sink, and a fan for blowing air thereto. However, in recent years, with the miniaturization and high integration of semiconduc...

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Problems solved by technology

However, when such pipes made of metal such as copper are used as passages for circulating the liquid refrigerant in the cycle, considering its plasticity, it is difficult to install such a liquid cooling system in the frame of the device. , and the performance of the subsequent maintenance operations will hinder

In particular, in the cooling system with the above-mentioned constitution, the cooling jacket is used as a component that is in direct contact with the surface of the CPU as a heat-generating element and thereby transfers the heat generated by it to the radiator as a heat-radiating part. ; When the pipes that flow the liquid refrigerant to the above-mentioned cooling jacket are formed with metal pipes, it is difficult to move the position of the cooling jacket freely. Therefore, installation work during installation and maintenance It becomes very troublesome to remove and install it during operation

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