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Self soldering solder used for brazing connecting PTC ceramic and aluminium alloy

An aluminum alloy and ceramic technology, applied in welding/cutting medium/material, welding medium, welding equipment, etc., can solve the problems of unsuitable brazing PTC ceramics, unsuitable PTC ceramic connection, weak bonding ability, etc. Reliability and long-term operation stability, improve brazing process performance, increase the effect of interface bonding strength

Inactive Publication Date: 2005-10-26
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The current method of connecting PTC ceramics and aluminum alloys is mainly to use glue bonding. Since the working temperature of PTC ceramics can reach up to 300 ° C, the process of using silica gel bonding has the following disadvantages: 1) Silica gel is easy to age during use, resulting in the deterioration of PTC ceramics. Power drops, which can lead to component damage in severe cases; 2) Due to the poor electrical and thermal conductivity of the silica gel in the joint layer, the role of PTC ceramics cannot be fully utilized; 3) The long-term stability and reliability of the joint glued with silica gel is poor; 4) Silicone During use, it will emit a peculiar smell when heated
Due to the addition of a large amount of Al, Zn72Al28 solder has a high melting point (430-500 ° C), which is not suitable for brazing PTC ceramics; Zn95Al5 is a solder with eutectic point composition, and its melting point (T m =380℃) is more suitable, but the solder is brittle, and when brazing PTC ceramics, a large internal stress is generated, and at the same time, the wettability of PTC ceramics is poor, and the bonding ability is weak, resulting in poor joint strength; Zn65Al20Cu15 is based on Zn-Al, Adding Cu lowers the melting point (415-425°C), but the content of Al and Cu is too high, and the solder is brittle. The solder also has poor wettability to PTC ceramics and weak bonding ability; Zn93Ag4.5Al2.5Si (melting point 390- 420 ℃) ​​is to add Ag to improve the wettability and corrosion resistance of the solder. The solder mentioned above has poor wettability to PTC ceramics, the solder is brittle, and the bonding ability is weak. Some melting temperatures are too high. After the welding connection, a large internal stress is generated, which reduces the joint strength and cannot meet the requirements of the connection of PTC ceramics.
No. 02133083.2 Chinese invention patent application "Self-brazing filler metal for aluminum alloys and aluminum-based composite materials and its preparation method" proposes a formula for medium-temperature, high-strength, flux-free brazing materials for aluminum alloys and aluminum-based composite materials. In terms of alloying elements, the melting point is higher than 400°C. This solder is used for brazing of aluminum alloys and aluminum matrix composite materials, and has superior performance. However, due to the high melting point alloy elements (to ensure strength), the solder has a higher melting point , also not suitable for the connection of PTC ceramics

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Put the PTC ceramics and aluminum plates with a size of 23mm × 13mm × 2.2mm on the heating plate for heating. ; Ag: 4.5%; Ti: 1.0%; Sn: 4.5%; Bi: 1.5%; Ga: 0.5%; rare earth: 0.025%; the balance is Zn and unavoidable impurities), after the solder is melted, use a scraper The method of rubbing makes the brazing filler metal expand, keep warm for one minute, then put the PTC ceramics on the aluminum plate, apply a little pressure, and cool slowly, and the brazing connection can be completed.

Embodiment 2

[0023] Put the PTC ceramics and aluminum plates with a size of 23mm × 13mm × 2.2mm on the heating plate for heating. ; Ag: 0.3%; Ti: 2.0%; Sn: 8.0%; Bi: 0.1%; Ga: 1.0%; rare earth: 0.5%; the balance is Zn and unavoidable impurities), after the solder is melted, use a scraper The method of rubbing makes the brazing filler metal expand, keep warm for one minute, then put the PTC ceramics on the aluminum plate, apply a little pressure, and cool slowly, and the brazing connection can be completed.

Embodiment 3

[0025] Put the PTC ceramics and aluminum plates with a size of 23mm × 13mm × 2.2mm on the heating plate to heat, the heating temperature is 400°C, put the brazing filler metal when it is warm (by weight percentage, the specific proportioning Al of the brazing filler metal: 7.0%) ; Ag: 6.0%; Ti: 0.01%; Sn: 1.0%; Bi: 3.0%; Ga: 0.01%; rare earth: 0.01%; the balance is Zn and unavoidable impurities), after the solder is melted, use a scraper The method of rubbing makes the brazing filler metal expand, keep warm for one minute, then put the PTC ceramics on the aluminum plate, apply a little pressure, and cool slowly, and the brazing connection can be completed.

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Abstract

A self-soldering solder for soldering PTC ceramics with Al alloy is proportionally prepared from Zn, Al, Ag, Ti, Sn, Bi, Ga and RE.

Description

technical field [0001] The invention relates to the technical field of brazing, in particular to a self-brazing filler metal for brazing and connecting PTC ceramics and aluminum alloys. Background technique [0002] The current method of connecting PTC ceramics and aluminum alloys is mainly to use glue bonding. Since the working temperature of PTC ceramics can reach up to 300 ° C, the process of using silica gel bonding has the following disadvantages: 1) Silica gel is easy to age during use, resulting in the deterioration of PTC ceramics. Power drops, which can lead to component damage in severe cases; 2) Due to the poor electrical and thermal conductivity of the silica gel in the joint layer, the role of PTC ceramics cannot be fully utilized; 3) The long-term stability and reliability of the joint glued with silica gel is poor; 4) Silicone During use, it will emit a peculiar smell when heated. [0003] Brazing technology has been widely used in th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/28
Inventor 卫国强杨永强
Owner SOUTH CHINA UNIV OF TECH
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