Wafer testing device and method with automatic reversion function
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- POWERCHIP SEMICON CORP
- Publication Date
- 2006-05-03
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
Figure 1 Figure 2
Abstract
Description
technical field
[0001] The invention relates to a wafer testing device and a wafer testing method, and in particular to a wafer testing device and a wafer testing method with an automatic recovery function. Background technique
[0002] In today's highly information-based society, the market for multimedia applications continues to expand rapidly, and at the same time drives the development of electronic devices towards the trend of digitalization, networking, regional connection and user-friendly use. In order to meet the above requirements, it is necessary to strengthen the requirements of high-speed processing, multi-function, accumulation, small size, light weight and low price of integrated circuit (Integrated Circuits, IC) components, so the semiconductor process is also moving towards miniature and high-density development. In the semiconductor industry, the production of integrated circuits is mainly divided into three stages: the manufacture of wafers, the manufact...