Wafer testing device and method with automatic reversion function

A technology of automatic reply and wafer testing, which is applied in the direction of semiconductor/solid-state device testing/measurement, etc., can solve problems such as low production efficiency, increased production cost, and extended testing time, so as to reduce the overall process time and cost and improve production. efficiency effect
CN1767164AInactive Publication Date: 2006-05-03POWERCHIP SEMICON CORP

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
POWERCHIP SEMICON CORP
Publication Date
2006-05-03
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a crystal sheet measuring device with reset function and the measuring method. The crystal sheet measuring device comprises a host machine system, a measuring system and an immediate access module. The host machine system is used to control the process of the integer measurement; the measuring system is electric connected with the host machine system and is used to receive the order of the host machine system to measure the plurality of crystals and output the measuring data. The immediate access module is electric connected with the measuring device and is used to record the measuring data. When the measuring has been interrupted, the measuring system generates an automatic reset data by the measuring data of immediate access module and measures the crystal by the automatic reset data.
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Description

technical field

[0001] The invention relates to a wafer testing device and a wafer testing method, and in particular to a wafer testing device and a wafer testing method with an automatic recovery function. Background technique

[0002] In today's highly information-based society, the market for multimedia applications continues to expand rapidly, and at the same time drives the development of electronic devices towards the trend of digitalization, networking, regional connection and user-friendly use. In order to meet the above requirements, it is necessary to strengthen the requirements of high-speed processing, multi-function, accumulation, small size, light weight and low price of integrated circuit (Integrated Circuits, IC) components, so the semiconductor process is also moving towards miniature and high-density development. In the semiconductor industry, the production of integrated circuits is mainly divided into three stages: the manufacture of wafers, the manufact...

Claims

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