Image pickup module and manufacturing method of image pickup module

Abstract

The camera module (1) of the present invention is provided with a tubular cover (19) and a lens holder (17). The cover (19) is fixed (bonded) to the substrate (11) with its legs (19a) in contact with the surface of the substrate (11). Moreover, the lens holder (17) is inserted into the inner surface (19b) of the cover (19), the lens holder (17) is in contact with the transparent plate (14) at its foot (17a) and its outer surface (17b) is in contact with the inner surface of the cover In the state, the outer surface (17b) of the lens holder (17) is fixed (bonded) on the inner surface (19b) of the cover (19). A lens (18) guiding the path of incident light to the light receiving portion (12a) of the imaging element (12) is fixed at a predetermined position on the lens holder (17).

Description

technical field [0001] The present invention relates to a camera module and a method of manufacturing the camera module in which an imaging element having a light receiving unit and a lens for imaging incident light on the light receiving unit are modularized (integrated). Background technique [0002] Imaging elements such as CCDs and CMOS imagers, which are semiconductors, are being used in various fields. In particular, in addition to the communication function, a mobile phone with a camera, which has a camera function added by mounting an imaging element, is widely put into practical use. With the miniaturization, thinning, and weight reduction of products such as mobile phones with cameras and digital cameras, camera modules in which imaging elements and lenses are modularized are also being put into practical use. [0003] In conventional imaging modules, an imaging element is disposed on a substrate, and the imaging element is electrically connected to wiring on the ...

AI Technical Summary

Problems solved by technology

[0006] However, in the structure disclosed in Japanese Patent Laid-Open No. 2000-125212, since the surface of the substrate is used as a positioning reference, mounting accuracy when the imaging element is mounted on the substrate is required, and at the same time, it is required to mount the lens holder holding the lens on the substrate. Position accuracy when on the substrate, but not necessarily fully simplify the installation process and improve focus accuracy

Although the surface accuracy of the substrate surface used as a positioning reference is important, since the surface of the substrate usually has unevenness, it needs to be smoothed, and there is a problem that the cost increases.

[0007] On the other hand, in the structure disclosed in JP-A-2001-351997, since the transparent plate and the lens holder are bonded, the bonding stress acts on the transparent plate. Cracks, and there is a danger that the transparent plate will be peeled off from the imaging element

Especially when used in mobile phones that require high impact resistance, it is not good

When the thermal expansion coefficients of the transparent plate and the lens holder are greatly different, the transparent plate is deformed due to the difference in thermal expansion coefficient during bonding, and the path of the incident light is shifted due to this influence, resulting in a problem of blurred focus.

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