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Hybrid laser machining method and hybrid laser torch used therein

A laser processing method and laser head technology, which are applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of sputter particle pollution, spray spatter, etc.

Inactive Publication Date: 2006-06-14
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In the technique described in Patent Document 4, although the particles reaching the focusing lens are cut off by an air knife, even if this satisfies the requirements, there is still the problem of sputtered particles being ejected into the atmosphere around the head, and the inside of the head is easily damaged. Contamination by sputtered particles
Even if this can be solved by spraying inert gas from the inside of the head, the problem of spraying the surrounding air to the welded part has not been solved.

Method used

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  • Hybrid laser machining method and hybrid laser torch used therein
  • Hybrid laser machining method and hybrid laser torch used therein
  • Hybrid laser machining method and hybrid laser torch used therein

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Embodiment Construction

[0093] Refer to the following Figure 1 to Figure 7 , to describe in detail the hybrid laser processing method and the hybrid laser head used in the method according to the embodiment of the present invention, for the understanding of the present invention. In addition, the following description is a specific example of this invention, and it does not limit the description of the scope of a claim.

[0094] The hybrid laser processing method related to this embodiment refers to figure 1 The hybrid laser head 1 shown, in order to irradiate the object 7 to be processed with different first and second laser beams 3 from two kinds of laser systems A and B and as a hybrid laser beam 6, as image 3 Focusing is carried out as shown, so that the focus diameter and effective spot size D2 of the second laser 5 in the mixed laser 6 on the processed object 7 are smaller than the focus diameter and effective spot size D1 of the first laser, so that the irradiation is Process the object 7 ...

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Abstract

The invention discloses a hybrid laser processing method and a hybrid laser head used in the method. Even for metal materials with high reflectivity, it is possible to weld with sufficient penetration depth and penetration width, and at a higher speed. The different first and second lasers from the two laser systems A and B are superimposed to form a mixed laser (6) and focused, if the second laser (5) and the first laser ( 3) The effective light spot sizes on the processed object (7) are respectively set to D2 and D1, so that D2 is smaller than D1, so that the processed object 7 is irradiated for processing, so as to achieve the above purpose.

Description

technical field [0001] The present invention relates to the superimposition of two different lasers from two laser systems such as the first laser generated by a solid laser medium such as YAG and the second laser generated by a semiconductor laser (hereinafter referred to as LD) as a hybrid laser to irradiate the object to be processed for processing A hybrid laser processing method and a hybrid laser head used in the method. Background technique [0002] In order to use laser for welding and other processing, there are several devices as follows. One is to focus one laser beam to make it have multiple focus positions on the optical axis corresponding to the welding width and welding depth, which can meet the specified welding penetration. depth (for example, refer to Patent Document 1); the second is to superimpose two kinds of YAG laser irradiation, so that even metal materials with high reflectivity and high heat dissipation rate can obtain sufficient penetration cross-s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/00B23K26/04B23K26/073B23K26/14B23K26/42H01S3/16
CPCB23K26/0604B23K26/0613B23K26/21
Inventor 樱井努远屋和浩船见浩司
Owner PANASONIC CORP
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