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Thickness measuring method for organic coating film on metal surface

A thickness measurement and film thickness technology, applied in measurement devices, color/spectral characteristics measurement, semiconductor/solid-state device testing/measurement, etc., can solve the problems of complexity and poor reliability, and achieve the effect of reducing any errors

Inactive Publication Date: 2006-06-14
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0012] However, the thickness measurement methods described above are nothing more than less reliable indirect measurement techniques performed under specific process conditions
In addition, the thickness measurement method becomes complicated because different thickness data are required for each processing condition

Method used

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  • Thickness measuring method for organic coating film on metal surface
  • Thickness measuring method for organic coating film on metal surface
  • Thickness measuring method for organic coating film on metal surface

Examples

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example 1

[0057] Place four (4) 10cm 2 A copper laminated plate was prepared as the substrate used in the thickness measurement. The copper surfaces of these laminates were cleaned and then etched under the same conditions as for conventional copper pads. Aqueous solutions of Alkil-benzene-imidazole (Alkil-benzene-imidazole) were applied to the surface of these 4 copper laminates for different time periods, and then water was removed from the copper laminates to prepare four reference organic coatings. Films A to D.

[0058] According to the FT-IR technique, IR absorption spectra were measured from these four reference organic coating films. Calculated from the measured IR absorption spectrum by integration from 1230 to 1290cm -1 range of absorption strength. The organic coating films exhibited absorption intensity values ​​of 15, 99.5, 153, and 160. Figure 6 a is a graph showing the IR absorption spectrum with respect to the reference organic coating film D. FIG.

[0059] Then, ...

example 2

[0063] Example 2 is applied to the thickness measurement method of the present invention by converting the correlation between the absorption intensity and thickness of the reference organic coating film obtained from Example 1, based on the absorption intensity information of the external standard material, into the absorption intensity ratio and A more precise correlation between thicknesses.

[0064] First, perylene was coated onto a highly polished Si wafer with a coating thickness of 1.2 μm, and absorption spectrum measurement was performed by IR spectroscopy. Plot the measured spectrum on Figure 7 a. Measure 1380 to 1520cm -1 The absorption intensity in the wavelength range, and the absorption intensity of the reference organic coating film measured in Example 1 was divided by the absorption intensity of perylene (about 765) to obtain the absorption intensity ratio. Absorption intensity ratios associated with organic coating films were 0.02, 0.13, 0.2, and 0.21. The...

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Abstract

The invention relates to a method for measuring the thickness of an organic coating film (such as an organic solderable protective film) formed on a metal surface. In this method, the absorption spectrum of at least one reference organic coating film formed on the first metal surface is measured, and the absorption intensity in a predetermined wavelength range is calculated from the absorption spectrum. The thickness of the reference organic coating film was measured by destructive measurement. Then, a correlation is determined based on the absorption intensity of the reference organic coating film and the measured thickness. Measure the absorption spectrum of the organic coating film to be measured. The absorption intensity in a predetermined wavelength range is calculated from the absorption spectrum of the organic coating film to be measured, and the thickness thereof is calculated from the absorption intensity of the organic coating film based on the correlation.

Description

[0001] related application [0002] This application is based on and claims priority from Korean Application No. 2004-102610 filed on December 7, 2004, the entire contents of which are hereby incorporated by reference. technical field [0003] The present invention relates to a method for measuring the thickness of an organic coating film (coating film), and more particularly, to a method for sub-substrates formed on metal pads (pads) such as copper pads with large surface roughness. Thickness measurement method of micron-scale organic solderable protective film. Background technique [0004] Coating film thickness is usually measured according to destructive and non-destructive techniques. Coated films lose their functionality in destructive analysis but retain their functionality in non-destructive techniques. Destructive techniques cause physical / chemical damage to the coating film to such an extent that it is very difficult to restore the coating film. Furthermore, de...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/06G01N21/33G01N21/35G01N21/3563H01L21/66
CPCG01B11/0625G01N21/25G01B9/02044
Inventor 崔熙圣李孝洙金真暎李熙珍
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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