Preparation of dedicated defoamer for printed circuit board

A defoaming agent and defoaming technology, which is applied in the preparation of special defoaming agents for non-organic silicon printed circuit boards, and in the field of defoaming agents for printed circuit boards. , Difficult to reach users, etc.

Inactive Publication Date: 2006-07-26
JIANGSU SIXIN SCI-TECH APPL RES INST CO LTD
View PDF2 Cites 22 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The defoamers currently on the market are mainly divided into two categories, silicone and non-silicon. The low surface tension of silicone makes it easy to bridge once the defoamer breaks, which affects the printing of circuit boards. Processing, non-organic silicon defoaming agent is mainly because the defoaming speed is not fast, it is difficult to achieve the user's purpose, which of course has a certain relationship with the dispersibility of non-organic silicon defoaming agent

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] 60 parts of antifoaming active substances (n=12, X is -O-, p=15, q=30, m=4) and 40 parts of antifoaming substances (x=0, y=4, z=3) The bulk defoamer A of the present invention can be obtained by mixing at room temperature.

Embodiment 2

[0021] 50 parts of antifoaming active substances (n=20, X is -COO-, p=20, q=35, m=0) and 50 parts of antifoaming substances (x=1, y=3, z=4) The bulk defoamer B of the present invention can be obtained by mixing at room temperature.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates a defoaming agent used for printed circuit board, which is highly effective, safe, cheap, no silicon, good water-dispersible and easy handing. The defoaming agent comprises the following components: 1 defoaming active matter, comprising polyoxyethylene and polypropylene oxide block polyether which are used aliphatic alcohol, aliphatic acid and fatty acid ester as start substance; 2 inferior defoaming substance, which are lower aliphatic alcohol / ether substance; 3 deflocculating agent. Dividing the defoaming agent into 100 parts, defoaming active matter is 5-100 parts, inferior defoaming substance is 0-90 parts, and others which have not 100 parts are added deflocculating agent.

Description

technical field [0001] The present invention mainly relates to the development of a defoamer for printed circuit boards (PCB), more precisely the preparation of a special defoamer for non-organic silicon printed circuit boards. The defoamer is a Fine chemical additives, therefore, the present invention belongs to the technical field of fine chemical preparations. Background technique [0002] Defoamer is a kind of fine chemical additive. As an additive, the primary function of defoamer is defoaming performance and antifoaming performance. Of course, its own stability and compatibility with other additives Resistance, shear resistance, etc. can not be ignored. [0003] At present, defoamers are mainly divided into two types: silicone and non-organic silicon according to their composition. They each have their own characteristics. Silicone defoamers are mainly composed of silicone oil and white carbon black. In industrial processes such as printing and dyeing, pulping and pa...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B01D19/04B01F17/42G03F7/00C09K23/42
Inventor 吴飞曹治平
Owner JIANGSU SIXIN SCI-TECH APPL RES INST CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products