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Heat spreader and package structure utilizing the same

A package and heat sink technology, applied in the direction of semiconductor devices, electric solid state devices, semiconductor/solid state device components, etc., can solve the problems of ILD delamination, etc., and achieve the effect of improving reliability and reducing thermal stress.

Inactive Publication Date: 2006-09-13
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, when using an ILD of a low dielectric constant material, the thermal stress generated during the packaging process will induce delamination of the ILD

Method used

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  • Heat spreader and package structure utilizing the same
  • Heat spreader and package structure utilizing the same
  • Heat spreader and package structure utilizing the same

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Embodiment Construction

[0026] In order to make the above-mentioned and other objects, features and advantages of the present invention more obvious and understandable, some preferred embodiments (a few) are specially enumerated below, together with the accompanying drawings, which are described in detail as follows:

[0027] The inventors of the present invention have discovered that a ball grid array (PBGA) package with a heat spreader embedded in it, commonly called HSBGA (heat spreader ball grid array), often has serious reliability problems. A chip containing an ILD layer of a low dielectric constant material in an HSBGA package often fails to pass thermal cycle tests (TCT) specified by JDEC. The inventors of the present invention found that the reason is that the thermal stress caused by TCT may cause delamination of the ILD near the corner of the chip that is the farthest from the potting port of the package substrate among the above-mentioned chips. When the HSBGA package fails the TCT test, it m...

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Abstract

A heat spreader and package structure utilizing the same. The heat spreader is embedded in an encapsulant of a package and above a chip therein, wherein the package has a substrate, having a molding gate, and the chip has a center and a corner which is the farthest from the molding gate. The spreader includes a base with a hollow portion therethrough, a plurality of support leads, protruding from the base, on the inner edge, and a cap plate, having a hole at least directly above a region between the center and the corner of the chip, fixed by the support leads to be above the hollow portion, the cap plate.

Description

Technical field [0001] The present invention relates to a packaging body, in particular to a packaging body with high reliability. Background technique [0002] With the increase in circuit density and the reduction in size of semiconductor devices, the number of layers of metal wire patterns must also be increased and the spacing must be reduced to effectively connect separate components in the semiconductor chip. Multiple layers of insulating films or insulating materials called inter-layer dielectric (ILD) are used to separate metal interconnects of different layers. Silicon oxide is often used as the ILD layer, and its dielectric constant is 4.0 to 4.5 (vacuum is 1). However, as the distance between the metal wires decreases, since the capacitance value is inversely proportional to the distance between the wires, the capacitance value within or between layers also increases, which increases the RC delay time. Since the RC delay time will adversely affect the signal transmissi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/36H01L23/28
CPCH01L2224/45124H01L2224/92125H01L23/3128H01L23/36H01L24/81H01L24/48H01L2924/01079H01L2224/81815H01L2224/81801H01L2224/16H01L2224/48227H01L2224/73253H01L23/4334H01L2924/01019H01L2924/01327H01L2924/15311H01L2224/45144H01L2224/8121H01L2224/83102H01L2924/00014H01L24/45H01L2924/181H01L2224/73265H01L2924/00011H01L2224/48137H01L2224/05599H01L2224/0401H01L2924/00012H01L2224/32225
Inventor 黄传德曹佩华林枫徐家雄
Owner TAIWAN SEMICON MFG CO LTD