Multi-wavelength LED structure and making process thereof

A light-emitting diode, multi-wavelength technology, used in semiconductor devices, electrical components, circuits, etc., can solve the problems of yellow halo, inaccuracy, and unpredictable color shift.

Inactive Publication Date: 2006-09-27
TAIWAN OASIS TECH CO LTD
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  • Abstract
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Problems solved by technology

[0003] figure 1 The multi-wavelength light-emitting diodes shown generally use blue chips to excite the yellow phosphor powder 51 mixed in the fluorescent glue 50 to produce "pseudo-white light" that looks like white light, but because similar multi-wavelength light-emitting diodes only transmit a single color The fluorescent powder is used as the complementary light excited by the light-emitting chip, resulting in poor color and yellow halo phenomenon of the formed "pseudo-white light"; as a result, the industry has also developed such figure 2 Shown is a multi-wavelength light-emitting diode structure in which two phosphors are mixed in the fluorescent glue. This type of multi-wavelength light-emitting diode generally uses a blue chip to excite the red phosphor 52 and the green phosphor 53 mixed in the fluorescent glue 50, In order to combine the red and green colors with the blue light of the light-emitting chip 10 to achieve the light mixing effect of the three primar

Method used

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  • Multi-wavelength LED structure and making process thereof
  • Multi-wavelength LED structure and making process thereof
  • Multi-wavelength LED structure and making process thereof

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[0024] In order to make your examiner clear about the composition and implementation of the present invention, I would like to explain with the drawings as follows:

[0025] According to the present invention "Multi-wavelength LED structure and its manufacturing process", the basic structure of the overall multi-wavelength LED is as follows image 3 As shown, the light-emitting chip 10 is also fixed in a carrier 20 by using the die-bonding glue 40, and the connection between the light-emitting chip 10 and the electrode terminal 21 is formed by the gold wire 30, and the light-emitting chip 10 is connected by the fluorescent glue 50 with fluorescent material. The encapsulation allows the light source of the light-emitting chip 10 to excite the fluorescent material of the fluorescent glue 50 when the light-emitting chip 10 is energized, so as to form a desired light color.

[0026] Among them, the overall multi-wavelength light-emitting diode is respectively covered with at least one...

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Abstract

This invention arranges at least one fluorescence material with fixed wavelength at the bottom and above the periphery of the luminous chip, when the luminous chip electrifies, it actives the luminous chip to form colored light with high luminous efficient, which can avoid disturbance, and because the fluorescence material's deal and proportion of different parts are easy to control, so this method is benefit for controlling the quality of the multi-wavelength radiation dipolar and its production.

Description

technical field [0001] The invention relates to the luminous efficiency and light color performance technology of light-emitting diodes, aiming to provide a multi-wavelength light-emitting diode structure and manufacturing process capable of producing high luminous efficiency and accurate gloss. Background technique [0002] Such as figure 1 As shown, it is a schematic diagram of the basic structure of a conventional multi-wavelength light-emitting diode. This multi-wavelength light-emitting diode uses a die-bonding glue 40 to fix the light-emitting chip 10 in a bowl-shaped carrier 20, and uses gold wires 30 to form a light emitting diode. The chip 10 is connected to the electrode terminal 21, and the light-emitting chip 10 is coated with the fluorescent glue 50 having phosphor powder, so that the light source of the light-emitting chip excites the phosphor powder of the fluorescent glue 50 under the power-on action of the light-emitting chip 10, so as to form the desired l...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L33/50
Inventor 李明顺何昌纬
Owner TAIWAN OASIS TECH CO LTD
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