Laser monitoring and control in a transmitter optical subassembly having a ceramic feedthrough header assembly
A head assembly, laser device technology, applied in lasers, phonon exciters, semiconductor lasers, etc., can solve problems such as MPD limitation or complete blocking
Inactive Publication Date: 2006-10-11
FINISAR
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Problems solved by technology
However, as already stated, the location of the optoelectronic device in the transistor header requires additional electrical interconnections through the header, which is not possible in known header designs that must adhere to the specified dimensional form factor
Therefore, the use of one or more MPDs in a transistor header assembly may be limited or prevented entirely
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[0043] Reference will now be made to the drawings, wherein like structures will be provided with like reference designations. It is to be understood that the drawings are diagrammatic and schematic representations of presently preferred embodiments of the invention and are not limiting of the invention, nor are they necessarily drawn to scale.
[0044] 1-13 describe various features of embodiments of the present invention, generally directed to an improved header assembly that allows for enhanced functionality of components disposed therein. Specifically, various embodiments of the present invention disclose a multilayer feedthrough structure integrated with a header assembly for use in a small form factor optical transceiver module. The multi-layer configuration of the feedthrough enables a significant expansion of both the number and types of electro-optical components that can be placed in the head assembly. Indeed, in the presently preferred embodiment, one or more monito...
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An improved monitoring and control system for a laser in a header assembly of a transmitter optical subassembly ("TOSA") is disclosed. The monitoring and control system, includes one or more monitor photodiodes ("MPDs"), is positioned together with the laser on a component submount. The submount in turn is mated with a multi-layer platform ("MLP") that forms part of the header assembly. The MLP hermetically extends through the header assembly to provide a plurality of electrical interconnects for the laser, MPD(s), and other submount components. In one embodiment, a single MPD is located proximate the laser to receive back facet laser light emission. Measurement of the back facet emission enables the MPD to determine laser intensity. In another embodiment, two MPDs are joined together to receive the back facet laser light emission. Comparison of each MPD's measurement enables the laser's wavelength to be determined and adjusted to optimize its performance.
Description
technical field [0001] The present invention relates generally to optoelectronic systems and devices. More specifically, embodiments of the present invention relate to transistor header assemblies for use in optical transceiver modules, wherein the header assemblies include various features for monitoring and adjusting the transceiver's laser devices for optimal performance. Background technique [0002] Fiber optic components and optoelectronic devices have become important components in modern networking circuits. The use of fiber optic circuits allows efficient, accurate and fast data transmission between various components in a networked system. [0003] As with most any system design, engineering design trade-offs must often be made when implementing a fiber optic system. For example, component size and modularity often must be balanced against the need for additional space to accommodate heat dissipation and circuit monitoring components. Although it is desirable to...
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IPC IPC(8): H05K5/06H01L23/02G02B6/42H01L23/055H01L23/10H01S5/02H01S5/022H01S5/024H01S5/062H01S5/0683
CPCH01S5/042H01S5/02415H01L2924/19107H01S5/0071H01S5/02212H01L2924/0002G02B6/42H01S5/02276H01L2224/48091H01L23/10H01S5/02248H01S5/06226H01S5/02284H01L2224/48227H01S5/0683H01L23/055H01S5/02251H01S5/02325H01S5/02345H01L2924/00014
Inventor 斯特凡诺·施亚菲诺乔治·贾雷塔帕特里克·乌诺尔德米纳·法尔
Owner FINISAR