Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

New type of plant cultivating medium and its prepn process and use

A substrate and plant technology, applied in the field of plant cultivation and planting substrate and its preparation, can solve the problems of lack of nutrients, easy to catch fire, aging, etc., and achieve the effects of saving watering labor, prolonging the service life and reducing costs

Inactive Publication Date: 2006-10-18
孟繁志
View PDF1 Cites 14 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] One of the objectives of the present invention is to overcome the shortcomings of existing foamed plastic plant cultivation substrates that lack nutrients, and are easy to catch fire and age when used outdoors, and provide a new type of plant cultivation substrate

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～4

[0040] The operation steps of embodiment 1~4 are as follows:

[0041] 1. Use a twin-screw waste foam recycling granulator to process waste polyamide (PU) foam to obtain qualified polyamide (PU) plastic particles.

[0042] 2. Then mix the following materials evenly according to the components and parts by weight ratio in the following table 1 (Example 1~4 list): foamed plastics, water retaining agent, nutrient, flame retardant, light stabilizer, and color Masterbatch.

[0043] 3. Then add the mixed material obtained in step 2 into the twin-screw extruder, and extrude it through the expansion tube at an extrusion temperature of 110°~150°C to obtain a density of 25~30kg / m 3 plant cultivation substrate products.

[0044] see table 1

[0045] List of Embodiments 1 to 4

[0046] Example

Embodiment 5

[0047] Embodiment 5 Application of the plant cultivation planting substrate obtained in Example 1 of the present invention in roof greening

[0048] Lay a layer of anti-root membrane on the roof, that is, a layered structure or coating made of rubber, plastic or other materials. Lay the 5 cm thick plant cultivation planting substrate obtained in Example 1 of the present invention on the anti-root film, then pave the dark drainage pipe, and then use water to soak the substrate for 2 hours to make it fully absorb water. When finished, a 10 cm layer of light soil is laid on the substrate and plants are planted.

[0049] After two months of observation, the plants grew well, and the water was saved by 50%, and the fertilizer was saved by 35%. After one year of use, the plant cultivation substrate of the present invention basically has no aging degradation phenomenon.

Embodiment 6

[0050] Example 6 Application of the Plant Cultivation Planting Substrate obtained in Example 1 of the present invention in indoor greening

[0051] Use a cutting knife to cut a cross-shaped incision to accommodate the rooting depth on the plant cultivation substrate obtained in Example 1 of the present invention, immerse the substrate in water, and squeeze out the air in the substrate by hand to make it fully absorb water. Remove the root soil of the planting plant, insert the planting plant firmly into the cut, and pay attention not to leave floating roots outside the cut. Put the plant substrate into the container, cover with pumice, sawdust up to the ornaments.

[0052] After two months of observation, the plants grew well, and the water was saved by 55%, and the fertilizer was saved by 35%.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Densityaaaaaaaaaa
Login to View More

Abstract

The present invention is one new type of plant cultivating medium and its preparation process and use. The plant cultivating medium includes plastic foam of density 8-80 kg / cu m in 60-99 weight portions, water maintaining agent with water absorbing rate of 50-800 wt% in 0.2-3 weight portions, and nutrient in 0.5-30 weight portions comprise nitrogen fertilizer, phosphate fertilizer, potash fertilizer and other nutritious components. The plant cultivating medium may be used for greening building surface, garden and flower bed, indoor greening and tissue culture.

Description

technical field [0001] The invention relates to the field of plant cultivation and planting, in particular to a plant cultivation substrate and a preparation method and application thereof. Background technique [0002] In recent years, the use of soilless substrates to cultivate plants has gradually become common. There are many types of soilless substrates. The most commonly used for potted flowers is peat soil mixed with a certain proportion of perlite or sand, and some granular organic compound fertilizers can also be mixed. In addition to peat soil-based mixed substrates, ceramsite specially fired for soilless plant cultivation has become more popular in recent years, and can also be used to grow flowers at home. In addition, wood chips, perlite, vermiculite and polymer water-absorbing materials can also be used as soilless cultivation substrates. [0003] With the increasing demand for greening on the surface of parks, streets, and especially buildings, foamed plasti...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): A01G31/00
Inventor 孟繁志张明文
Owner 孟繁志
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com