High precision silicon slice bench and uses thereof

Abstract

The invention discloses a high-precision silicon chip table and utility, which comprises the following parts: air-float support, leveling organization, plane motor and reed, wherein the square lens is set on the reed, which is supported by at least three square lens supports with bottom on the upper surface of leveling organization; the sucker is set on the upper surface of square lens to place silicon chip; the electric vortex sensor is set between air-float support and square lens; the leveling organization is composed of at least three leveling executers along circumferential direction, which correspond to square lens supports; the mirror plane is set on the square lens, which aligns mark board and reflects laser beam. The invention can assemble high-precise silicon chip within 50 nm vertical precision and 10 nm leveling precision, which improves manufacturing precision of semiconductor equipment greatly.

Description

technical field [0001] The invention relates to the field of semiconductor equipment manufacturing, and relates to a high-precision silicon wafer table and use thereof. Background technique [0002] Most of the traditional silicon wafer table structures use contact-type guide rail bases, which have large motion friction resistance, high heat generation, and it is difficult to keep the dynamic and static friction coefficients consistent. Crawling also occurs. This traditional silicon wafer stage structure can no longer meet the high-precision positioning problem of silicon wafers at high speed or high acceleration, which affects the manufacturing accuracy of semiconductor equipment to a large extent, and thus hinders the development of the semiconductor manufacturing industry. . SUMMARY OF THE INVENTION [0003] The purpose of the present invention is to provide a high-precision silicon wafer table and its application, which can enable the silicon wafer to have six degree...

AI Technical Summary

Problems solved by technology

[0002] Most of the traditional silicon wafer stage structures use contact-type guide rail bases, which have large frictional resistance and high heat generation. It is difficult to keep the same dynamic and static friction coefficients. There will also be crawling

This traditional silicon wafer table structure can no longer meet the high-precision positioning of silicon wafers at high speed or high acceleration, which greatly affects the manufacturing accuracy of semiconductor equipment, and thus hinders the development of semiconductor manufacturing industry

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