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Sensor and sensor system for optically detecting objects, insertion head, method for determining the height position of a component

An optical detection and sensor technology, applied in the field of optical detection, can solve the problems of expensive measuring devices and difficult calibration of measuring devices, and achieve the effect of simple calibration and low price

Active Publication Date: 2006-11-29
SIEMENS ELECTRONICS ASSEMBLY SYST LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The optical measuring device has the disadvantage that a plurality of optical components are required for each optical projection system, making the measuring device overall more expensive
Another disadvantage is that the measuring device can only be calibrated with difficulty

Method used

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  • Sensor and sensor system for optically detecting objects, insertion head, method for determining the height position of a component
  • Sensor and sensor system for optically detecting objects, insertion head, method for determining the height position of a component
  • Sensor and sensor system for optically detecting objects, insertion head, method for determining the height position of a component

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Embodiment Construction

[0033] figure 1 The sensor 100 shown in is used for position detection of a component 180 which is picked up by a holding device 165 of an assembly head, not shown. The sensor comprises an optical module 120 and an electronic module 130 to which different optical or electronic components of the sensor 100 are respectively assigned. The electronic module 130 comprises a function generator 131 as a clock generating unit, the function generator 131 is electronically coupled to the light emitting diode 115 such that the light emitting diode 115 emits light in a periodically modulated manner according to the output signal of the function generator 131 . The light-emitting diodes 115 can be arranged inside the electronics module 130 or also outside the electronics module 130 .

[0034] The light-emitting diode 115 is optically coupled to the optical waveguide 100 , wherein the light emitted by the light-emitting diode 115 is coupled into the fiber core 111 of the optical waveguide...

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Abstract

This invention is a sensor for optical detection. The sensor is comprised of point-like light-emitting component (322) for emitting measure light, optical receiving element (328) and analysis unit for receiving measure light plane. The analysis unit (180) is arranged between the light-emitting component and the optical receiving element and can examine by photic blind. Further more, this sensor system of the invention can bear two sensors by allotting their analysis units to a same electronic module. This invention can also used to take up, convey and mount assembly head (350) of setting element (380), and the assembly head is comprised of base body (360), element holding unit (362) and this invention sensor. This invention also illuminates method for setting the height for picking up element from the holding unit, wherein the sensor, the sensor system or the assembly head are used.

Description

technical field [0001] The invention relates to sensors and sensor systems for the optical detection of objects, in particular for the presence control and / or position determination of electronic components, wherein the electronic components are respectively assembled for the purpose of mounting on a component carrier The holding device for the head (Bestueckkopf) is picked up. Furthermore, the invention relates to a mounting head for picking up components, transporting the components and placing the components on a component carrier to be assembled. Furthermore, the invention relates to a method for determining the height position of a component picked up by a holding device using the above-mentioned sensor, the above-mentioned sensor system or the above-mentioned assembly head. Background technique [0002] In the case of automatic assembly of component carriers by an automatic assembly machine, an assembly head with one or more holding devices removes the components from...

Claims

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Application Information

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IPC IPC(8): H05K13/08H05K13/04G01N21/84G06K9/20
CPCH05K13/0413G01B11/0608G01B11/2433H05K13/0812
Inventor S·伯格
Owner SIEMENS ELECTRONICS ASSEMBLY SYST LLC
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