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Providing differentiated levels of solder paste for a circuit paste for a circuit board

A technology of horizontal height and circuit board, applied in the direction of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problems of reducing circuit board production efficiency, reducing production capacity, expensive end products, etc., achieve good shielding effect, simplify installation, The effect of reducing related costs

Inactive Publication Date: 2010-05-05
SONY ERICSSON MOBILE COMM AB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This is a time-consuming step that reduces board production efficiency, making boards more expensive and reducing throughput in processes such as producing products such as mobile phones
As a result, production capacity is reduced and the end product is therefore more expensive

Method used

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  • Providing differentiated levels of solder paste for a circuit paste for a circuit board
  • Providing differentiated levels of solder paste for a circuit paste for a circuit board
  • Providing differentiated levels of solder paste for a circuit paste for a circuit board

Examples

Experimental program
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Effect test

Embodiment Construction

[0053] In the process of arranging and connecting electrical components to circuit boards, controlled amounts of electrical contact material in the form of solder paste are employed. This amount is tightly controlled to provide enough solder paste to solder the component's legs to the board's contact pads without spreading to the outside and causing the risk of contact between other legs of the same component or between other components . In many types of applications, like for example in the field of mobile telephony, shielding enclosures are required to shield the components used from radiation caused by, for example, antennas. These shields typically require more solder than the components to provide good shielding. This is especially the case where the plates are bent or bowed due to the heat in the furnace used to perform the welding. In this case, the shield may require additional solder paste to ensure a good shield. There is thus a need for a method of providing var...

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PUM

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Abstract

The present invention relates to a method and apparatus for providing differentiated levels of electrical contacting material on a circuit board (22), where a first screen (24) is placed on the circuit board, electric contacting material is placed in holes (26) provided in the first screen (24) in order to provide at least a first set of areas with contacting material (28) on the board, which areas each have a first level of contacting material, a second screen (30) is placed on the board, which second screen is provided with openings (32) aligned with and facing areas with contacting material(28) provided via the first contacting material masking screen, and electric contacting material is placed in holes (34) provided in the second screen, in order to provide a second set of areas withcontacting material (36) on the board, which areas each have a second level of contacting material.

Description

technical field [0001] The present invention relates generally to the field of mounting components and other devices on circuit boards. More specifically, the present invention is directed to a method and apparatus for providing different levels of electrical contact material on a circuit board. Background technique [0002] In the process of soldering components to circuit boards, it is normal practice to utilize a perforated screen applied to said circuit board. Solder paste is then disposed in the holes of the screen. The assembly is then placed on top of the board and soldered by heating the entire structure in an oven to provide an electrical connection between the contact legs of the assembly and the contact pads of the board. [0003] To provide good soldering results, a controlled amount of solder must be applied. For example, if too much solder is applied to a small circuit, the solder may smear out and cause contact between two different solder legs of the circu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34H05K3/12
CPCH05K3/3484H05K2201/09736H05K2203/1476H05K3/1225H05K2201/0379H05K3/3485
Inventor 古斯塔夫·法格瑞尼斯
Owner SONY ERICSSON MOBILE COMM AB