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Package for high frequency waves containing high frequency electronic circuit

An electronic circuit and high-frequency technology, which is applied in the field of high-performance high-frequency packaging, can solve the problems of damaging high-frequency characteristics, failing to obtain sufficient current capacity, and increasing the resistance component of the output side, and achieve the effect of increasing the current capacity

Active Publication Date: 2007-03-21
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, even in such a package, the resistance component on the output side becomes high, and sufficient current capacity cannot be obtained, and the above-mentioned problems may occur.
In addition, there is a disadvantage that high-frequency characteristics are impaired when the line width of the input terminal or output terminal changes rapidly

Method used

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  • Package for high frequency waves containing high frequency electronic circuit
  • Package for high frequency waves containing high frequency electronic circuit
  • Package for high frequency waves containing high frequency electronic circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] Hereinafter, embodiments of the present invention will be described in detail.

[0018] FIG. 1 is a diagram showing a high-frequency package in one embodiment of the present invention viewed obliquely from above. The ground metal plate 13 in the lower part of the high-frequency package needs to be selected from a metal having characteristics as a high-frequency ground and good heat conduction. For example, Cu, CuW (copper tungsten), CuMo (copper molybdenum), or the like can be selected. A ceramic having a thickness of about 0.6mm is used as the terminal forming substrate, which will become the lower dielectric 17b as described below.

[0019] A metal frame 12 made of, for example, Cu with a width of about 0.7 mm and a height of about 5 to 8 mm, or an alloy of Fe, Ni, and Co, is joined to the upper portion of the ground metal plate 13 .

[0020] There is a gap on the metal frame 12 , and an input terminal 10 and an output terminal 15 are formed through a feedthrough 14...

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PUM

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Abstract

In an embodiment of the invention, a package for high frequency waves mounted by a high frequency electronic circuit comprises an hermetic box-shaped high frequency package containing a high frequency electronic circuit in the inside and shielded by a conductor, an input terminal and an output terminal partly led out to the outside of the high frequency package, an input side feed-through section having one of its opposite ends connected to the input terminal and the other end connected to the high frequency electronic circuit and having a predetermined characteristic impedance; and an output side feed-through section having one of its opposite ends connected to the output terminal and the other end connected to the high frequency electronic circuit and having a characteristic impedance lower than the characteristic impedance of the input side feed-through section as viewed from the output terminal side.

Description

[0001] REFERENCE TO RELATED APPLICATIONS This application is based on the priority of Japanese Patent Application No. 2005-266938 filed on September 14, 2005. Here, the content of this Japanese application is cited and integrated with the present application. technical field [0002] The present invention relates to a high-frequency package (package), in particular to a high-performance high-frequency package capable of outputting a large current. Background technique [0003] In the microwave field, from devices to measuring instruments, systems are generally designed in the 50Ω type. [0004] Similarly, in high-frequency packages that incorporate high-frequency components and matching circuits, the characteristic impedance seen from the input terminal or output terminal is generally designed to be 50Ω. In addition, generally, the shape and size of the input terminal and the output terminal are made the same regardless of the magnitude of the current flowing. However, sin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/66H01L23/48
CPCH01L2924/1903H01L2924/3011H01L2924/01025H01L23/552H01L2924/14H01L24/49H01L23/66H01L2223/6627H01P5/02H01L2224/49175H01L2924/30107H01L2924/3025H01L2924/1423H01L2924/1305H01L2924/30111H01L2924/00014H01L2224/45014H01L2924/00H01L2224/45099H01L2224/45015H01L2924/207H01L2924/206H01L23/48
Inventor 高木一考
Owner KK TOSHIBA
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