Substrate drying device and method, and substrate producing method

A technology of a drying device and a drying method, which is applied in the field of substrate manufacturing and can solve the problems of low drying substrate capacity and the like

Inactive Publication Date: 2007-04-04
HITACHI HIGH-TECH CORP
View PDF1 Cites 18 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] On the other hand, the technique described in Patent Document 1 is not suitable for moving substrates at high speeds because of its lower ability to dry substrates compared to the case where an air knife is used.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate drying device and method, and substrate producing method
  • Substrate drying device and method, and substrate producing method
  • Substrate drying device and method, and substrate producing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] FIG. 1 is a diagram showing a schematic configuration of a substrate drying apparatus according to an embodiment of the present invention. The substrate drying device includes a liquid film forming chamber 20 and a liquid film removing chamber 30 . In the liquid film forming chamber 20 and the liquid film removing chamber 30 , a plurality of rollers 10 are provided at predetermined intervals, and the substrate 1 mounted on the rollers 10 moves in the substrate moving direction indicated by the arrow by the rotation of the rollers 10 .

[0032] Furthermore, in the present embodiment, the substrate 1 is moved in a horizontal state, but the present invention is not limited thereto, and may be in a direction perpendicular to the substrate moving direction or at a predetermined angle relative to the horizontal direction. In an inclined state, the substrate 1 is moved.

[0033] In the front stage of the liquid film forming chamber 20 , for example, a cleaning chamber is arra...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The present invention can move substrates with high speed, at the same time equably dry substrates. Nozzle (21) supplies cleaning liquid to the surface of the substrate 1, air knives (22a, 22b) eject air to the surface of back of the substrate (1). The air ejected from air knife (22a) makes the cleaning liquid supplied by nozzle (21) move toward the opposite direction of the substrate moving direction on the substrate (1). Adjusting the quantity of the cleaning liquid supplied by nozzle (21) and the quantity and speed of the air ejected from air knife (22a) in order to make the cleaning liquid moving speed slower than the substrate moving speed. Therefore, forming the continuous and thin liquid film of cleaning liquid on the whole surface of the substrate (1) under the air knife (22a). The liquid film forming on the surface of the substrate (1) is vaporized when it through the lower part of the halogen lamp (31), and is wiped off from one end of the substrate (1) continuously.

Description

technical field [0001] The present invention relates to a substrate drying device for drying panel substrates (panel substrates) for flat panel display devices, a substrate drying method, and a substrate manufacturing method using these, and particularly relates to a substrate suitable for high-speed movement. A substrate drying apparatus for drying a substrate, a substrate drying method, and a substrate manufacturing method using these. Background technique [0002] In the manufacturing process of a panel substrate for a flat panel display device such as a liquid crystal display device or a plasma display device, in order to form a circuit pattern or a color filter on the substrate, Chemical solution processing such as developing or etching is carried out. Moreover, before or after the chemical solution treatment, the substrate must be cleaned with a cleaning solution such as pure water, and the cleaned substrate must be dried. For a series of processes including cleaning...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00H01L21/30F26B7/00B08B3/00
Inventor 森口善弘安池良友
Owner HITACHI HIGH-TECH CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products