High-heat conductive efficiency circuit board

Abstract

The invention is concerned with the high heat conductivity circuit board, it is: covers a insulating layer on the base; sets a circuitry on the insulating layer; uses one position of the circuit to set a semiconductor CMOS chip; covers a heat conducting insulating layer that contains of diamond powder, or diamond and the diamond-like carbon film on the outer surface of the circuit; the insulating layer is used to quickly conduct the high heat from the circuit directly and the high heat from the semiconductor CMOS chip indirectly, and removes the high heat to outside, in order to maintain the normal working temperature of the circuit; the heat conducting insulating layer can replace the weld-resist layer of the existing circuit base, makes the high heat from the high power semiconductor CMOS chip can transfer by the circuit and the heat conducting insulating layer, process exchange and radiate with the outside air quickly.

Description

Technical field [0001] The present invention relates to a circuit board, in particular to a circuit board with high thermal conductivity. It has a thermally conductive insulating layer that can provide a semiconductor chip mounted on the circuit board with good thermal conductivity, so as to prevent the semiconductor chip from being accumulated due to high heat. Failure or damage. Background technique [0002] Most electronic components, especially integrated circuit components, are packaged with chips on a bare circuit board, and the chip contacts are connected to the bare circuit board contacts. In order to avoid oxidation of the metal substrate of the bare circuit board, The metal substrate is covered with an insulating layer to isolate the outside contact with the substrate. [0003] 3, the existing bare circuit board is mainly formed with an insulating layer 91 on an aluminum substrate 90, a circuit 92 is formed on the insulating layer 91, and a solder mask 93 covering the c...

AI Technical Summary

Problems solved by technology

However, the existing solder resist layer 93 is made of polyimide (Polyimide), the thermal conductivity of this material is extremely poor, causing the high heat generated by the LED 98 to transfer to the copper circuit 92 and cannot effectively pass through the solder resist layer 93 to continue to the copper circuit 92. Due to external heat dissipation, high heat accumulates on the copper wire 92, causing the LED 98 to continue to heat up and cannot operate stably, and what is more, it will be damaged due to high temperature

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