Component mounting method and component mounting apparatus

An installation method and a technology for installation devices, which are applied in the direction of assembling printed circuits, electrical components, electrical components, etc. with electrical components, can solve problems such as no compensation control, increased electrical positives, poor conduction, etc., and achieve the effect of shortening the installation time
CN1965401AInactive Publication Date: 2007-05-16PANASONIC CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
PANASONIC CORP
Publication Date
2007-05-16
Estimated Expiration
Not applicable · inactive patent

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Abstract

There has been a possibility of deteriorating planarity of a thin IC chip due to process distortion and deformation generated when sucking the IC chip by a suction nozzle. The deformation is corrected by pressing the thin IC chip on a board (4) with a prescribed load by a suction nozzle (11) having a suction plane (11b) formed flat. A reduction of a prescribed opposing interval between the IC chip and the board (4), due to thermal expansion caused by heat applied for melting a solder bump (1a) formed on an electrode, is corrected by controlling rising of the suction nozzle (11). A peeling action of the melting part, due to a part which has heat- expanded and contracted by cooling, is corrected by controlling descending of the suction nozzle (11). Thus, an electronic component mounting method and an electronic component mounting apparatus are provided for correctly mounting even the electronic components, such as the thin IC chip easily deformed and the IC chip wherein a multitude of electrodes are formed at a narrow pitch.
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Description

technical field

[0001] The present invention relates to a mounting method and device for mounting electronic components on a substrate as a mounting object by using a flip-chip mounting method, and particularly relates to electronic components such as thin IC chips or IC chips in which a plurality of electrodes can be formed at narrow pitches , A component mounting method and a component mounting device that are mounted on a substrate with high precision. Background technique

[0002] As one of the technologies supporting the remarkable progress in weight reduction, thinning, and high performance of portable information devices such as notebook computers and mobile phones, there is high-density mounting technology. With the development of high-density integration of IC chips, the number of electrodes serving as external connection terminals increases and is formed at a finer pitch. In order to mount the IC chip, and to prevent short circuits and poor connections to the elect...

Claims

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