Glass substrate optical display infra-red sensor

Abstract

The glass substrate optical reading infrared sensor features in the light through but infrared blocked glass substrate, side support flat beam unit with two sets of thermal deformation mechanism at both sides of the infrared absorbing plate, baffling distributed through the heat insulation beam and thermal deformation beam. The thermal deformation mechanism connected to both sides of the infrared absorbing plate with its inner side, with the outside end beam fixed on the glass substrate through the anchor erect. The heat insulation beam is nonmetallic film, the heat deformation beam is dual material beam formed on the nonmetallic film coated on the metal film, infrared absorbing plate having its reflective surface facing the glass substrate, visible light passing through the glass substrate projected on the reflective surface, with the infrared light directly projecting on the other side. It eliminates the frame structure, alleviates the dimensional conflict on the same flat layer due to the heat deformation mechanism and the infrared absorbing plate, effectively improving the super infrared detection sensitivity.

Description

technical field

[0001] The invention relates to a sensing element for acquiring and converting infrared radiation signals of an object, in particular to an optical readout thermal infrared image sensor based on a microbeam array. Background technique

[0002] The peak band of infrared radiation of objects at room temperature is 8-14 microns. Infrared imaging for this band mainly includes quantum and thermal imaging devices.

[0003] Quantum infrared imaging needs to cool the target surface of the detector, and the additional cooling equipment makes the whole device bulky and expensive, which is not conducive to civilian use and mass popularization.

[0004] The thermal imaging device does not need a refrigeration device, reduces volume, reduces cost, maintains high precision, and has wide application prospects. The thermal infrared imaging devices currently on the market read out the pyroelectric signals on the thermal pixels of the detector array electrically to obtain inf...

Examples

Embodiment 1

[0048] Referring to Fig. 1, Fig. 2, Fig. 3, Fig. 4 and Fig. 5, a glass substrate 5 that is transparent to visible light but not infrared is adopted, and a microbeam unit 12 with a lateral support planar structure is arranged on the glass substrate 5; the microbeam unit 12 Contains thermal deformation mechanism and infrared absorbing plate 3.

[0049] As shown in FIG. 2 , there are two groups of thermal deformation mechanisms, which are symmetrically arranged on both sides of the infrared absorbing plate 3 , and each group of thermal deformation mechanisms consists of at least one thermal isolation beam 1 and at least one thermal deformation beam 2 to form a folding distribution.

[0050] As shown in FIG. 3 , the thermal deformation mechanism is connected to both sides of the infrared absorbing plate 3 with its inner end, and its outer final beam end is fixed on the glass substrate 5 in a standing form through anchor feet 4 .

[0051] As shown in Figure 3, Figure 4 and Figure 5...

Embodiment 2

[0062] Referring to Fig. 12, Fig. 13 and Fig. 14, the difference from the above-mentioned embodiment 1 is that in this embodiment, the infrared absorbing plate adopts a double-layer structure, and the heat-absorbing resonant cavity is formed by the lower reflective plate and the upper heat-absorbing resonant plate 8 , between the reflective plate and the heat-absorbing resonant plate are connected by ribs 9, and the distance between them is , where λ is the peak value of the detected infrared wavelength, and n is a positive integer.

[0063] In specific implementation, the thickness of the lower reflective plate and the upper heat-absorbing resonant plate 8 is 0.3-3um, the thickness of the thermal isolation beam 1 and the thermal deformation beam 2 is 0.2-3um, and the distance between the micro-beam unit 12 and the glass substrate 5 is 2-3um. 7um.

[0064] In this structural form, the lower surface of the lower reflective plate is a reflective surface for optical readout det...

Embodiment 3

[0066] Referring to Fig. 15, Fig. 16 and Fig. 17, the difference from the above-mentioned embodiment 2 is that in this embodiment, on both sides of the upper heat-absorbing resonant plate 8, an eave structure is extended to increase the duty cycle of the heat-sensitive unit, The eaves just cover the area where the thermal deformation mechanism is located. The eaves structure of the heat-absorbing resonant plate 8 can increase the duty cycle of the unit, thereby improving the absorption efficiency of infrared rays and improving the detection sensitivity.

[0067] In the above-mentioned embodiments, the infrared absorbing plate 3 is made of a thin film material that has a strong absorption effect on infrared rays, such as SiN x , SiO 2 , made of polysilicon, etc., the absorption area should be as large as possible to increase the heat absorbed. Moreover, in the sensitive direction of angular deflection, the optical detection sensitivity is directly proportional to the length o...

technical field

[0001] The invention relates to a sensing element for acquiring and converting infrared radiation signals of an object, in particular to an optical readout thermal infrared image sensor based on a microbeam array. Background technique

[0002] The peak band of infrared radiation of objects at room temperature is 8-14 microns. Infrared imaging for this band mainly includes quantum and thermal imaging devices.

[0003] Quantum infrared imaging needs to cool the target surface of the detector, and the additional cooling equipment makes the whole device bulky and expensive, which is not conducive to civilian use and mass popularization.

[0004] The thermal imaging device does not need a refrigeration device, reduces volume, reduces cost, maintains high precision, and has wide application prospects. The thermal infrared imaging devices currently on the market read out the pyroelectric signals on the thermal pixels of the detector array electrically to obtain inf...

Examples

Embodiment 1

[0048] Referring to Fig. 1, Fig. 2, Fig. 3, Fig. 4 and Fig. 5, a glass substrate 5 that is transparent to visible light but not infrared is adopted, and a microbeam unit 12 with a lateral support planar structure is arranged on the glass substrate 5; the microbeam unit 12 Contains thermal deformation mechanism and infrared absorbing plate 3.

[0049] As shown in FIG. 2 , there are two groups of thermal deformation mechanisms, which are symmetrically arranged on both sides of the infrared absorbing plate 3 , and each group of thermal deformation mechanisms consists of at least one thermal isolation beam 1 and at least one thermal deformation beam 2 to form a folding distribution.

[0050] As shown in FIG. 3 , the thermal deformation mechanism is connected to both sides of the infrared absorbing plate 3 with its inner end, and its outer final beam end is fixed on the glass substrate 5 in a standing form through anchor feet 4 .

[0051] As shown in Figure 3, Figure 4 and Figure 5...

Embodiment 2

[0062] Referring to Fig. 12, Fig. 13 and Fig. 14, the difference from the above-mentioned embodiment 1 is that in this embodiment, the infrared absorbing plate adopts a double-layer structure, and the heat-absorbing resonant cavity is formed by the lower reflective plate and the upper heat-absorbing resonant plate 8 , between the reflective plate and the heat-absorbing resonant plate are connected by ribs 9, and the distance between them is , where λ is the peak value of the detected infrared wavelength, and n is a positive integer.

[0063] In specific implementation, the thickness of the lower reflective plate and the upper heat-absorbing resonant plate 8 is 0.3-3um, the thickness of the thermal isolation beam 1 and the thermal deformation beam 2 is 0.2-3um, and the distance between the micro-beam unit 12 and the glass substrate 5 is 2-3um. 7um.

[0064] In this structural form, the lower surface of the lower reflective plate is a reflective surface for optical readout det...

Embodiment 3

[0066] Referring to Fig. 15, Fig. 16 and Fig. 17, the difference from the above-mentioned embodiment 2 is that in this embodiment, on both sides of the upper heat-absorbing resonant plate 8, an eave structure is extended to increase the duty cycle of the heat-sensitive unit, The eaves just cover the area where the thermal deformation mechanism is located. The eaves structure of the heat-absorbing resonant plate 8 can increase the duty cycle of the unit, thereby improving the absorption efficiency of infrared rays and improving the detection sensitivity.

[0067] In the above-mentioned embodiments, the infrared absorbing plate 3 is made of a thin film material that has a strong absorption effect on infrared rays, such as SiN x , SiO 2 , made of polysilicon, etc., the absorption area should be as large as possible to increase the heat absorbed. Moreover, in the sensitive direction of angular deflection, the optical detection sensitivity is directly proportional to the length o...

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