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Electret capacity microphone

A condenser microphone, electret technology, applied in electret electrostatic transducers, electrostatic transducer microphones, electrostatic sensors, etc., can solve the problem of inability to use terminal 4 solder to solder wiring substrates, etc., to improve heat resistance Effect

Inactive Publication Date: 2007-06-20
HOSIDEN CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, when the height of the terminal 4 is lower than the height of the curled portion 3, it is impossible to solder the terminal 4 to the wiring board (not shown) on the equipment side by using a reflow device.

Method used

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  • Electret capacity microphone
  • Electret capacity microphone
  • Electret capacity microphone

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] 3 to 5 show the case where the present invention is applied to a front pole type electret condenser microphone. Fig. 3 is a sectional view showing a front pole type electret condenser microphone in a completed state, Fig. 4 is a perspective view showing an example of a terminal structure mounted on a wiring board 2, Fig. 5A and Fig. 5B are front pole type electret condenser microphones shown in Fig. 3 An exploded perspective view of the components of the electret condenser microphone.

[0039]As shown in FIGS. 5A and 5B , the conductive container 1 is a cylindrical body with one end closed to the front panel 1A and the other end opened. In addition, although it is a cylindrical body in the figure, it is not limited to this cylindrical shape. The front panel 1A has a sound hole 1B through which sound waves are introduced into the conductive container 1 . In the case of a front-type electret condenser microphone, at least the inner surface of the front panel 1A of the c...

Embodiment 2

[0048] Fig. 6 shows an example of applying the present invention to a back-type or sheet-type electret condenser microphone. In addition, FIGS. 7A and 7B are exploded perspective views of components constituting the back-type or sheet-type electret condenser microphone shown in FIG. 6 . In the back-type or sheet-type electret condenser microphone, the conductive vibrating membrane 7 , the insulating spacer 6 , and the fixed electrode 12 are arranged from the front panel side of the conductive container 1 . In addition, the sound hole 12A is also formed in the fixed electrode 12, and the space between the fixed electrode 12 and the wiring board 2 is not sealed.

[0049] A cylindrical synthetic resin molded member 11 is provided between the inner peripheral surface of the back electrode type and the sheet type conductive container 1 and each member. The cylindrical synthetic resin molded member 11 functions to insulate the conductive container 1 from the fixed electrode 12 and ...

Embodiment 3

[0055] Fig. 9 shows an enlarged sectional view of an example of applying the present invention to a reduction type electret condenser microphone. FIG. 10A is an exploded perspective view showing components constituting the reduction-type electret condenser microphone shown in FIG. 9 . The reduction-type electret condenser microphone has a structure in which a fixed electrode 12 , a spacer 6 , and a conductive diaphragm 7 are arranged from the front panel side of a conductive container 1 . In this embodiment, a metal mesh 13 is arranged between the fixed electrode 12 and the front panel 1A, and the surface of the fixed electrode 12 on the conductive diaphragm side is covered with an electret polymer film 5 made of a heat-resistant material. The distance between the fixed electrode 12 and the conductive vibrating film 7 is maintained at a predetermined distance by the thickness of the spacer 6 . In addition, the conductive vibrating membrane 7 and the adjustment ring 9 are insu...

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PUM

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Abstract

An object of the present invention is to provide a digital-output electret condenser microphone capable of being soldered on a wiring substrate of an apparatus by using a reflow furnace. An electret condenser microphone according to the present invention has an electret polymer film and a spacer that are formed of a heat-resistant material. Sound apertures are provided in a front panel of the electrically conductive capsule and / or the wiring substrate. Provided on the surface exposed in the open end of the electrically conductive capsule are multiple terminals, including at least a power supply terminal, a digital signal output terminal, and a clock input terminal. The terminals are protruded outward beyond a caulked part at the open end of the electrically conductive capsule.

Description

technical field [0001] The present invention relates to electret condenser microphones used in cellular phones, video cameras, personal computers, and the like. Background technique [0002] When mounting an electronic component on a wiring board, an automatic soldering device called a reflow device is generally used to solder the pad surface provided on the wiring board to the component terminal. In the reflow apparatus, a wiring board on which a component to be mounted is mounted is passed over molten solder. Then, when passing, a part of the molten solder is brought into contact with the land surface provided on the wiring board and the terminal of the component, and the land surface of the wiring board and the terminal of the component are solder-bonded. Therefore, the high temperature of the melting temperature of the solder (about 260° C.) is instantaneously applied to the mounted component. [0003] On the other hand, the electret condenser microphone uses the polar...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/01H04R19/04
CPCH04R19/016H04R1/04H04R31/006
Inventor 井土俊朗中西贤介粟村竜二
Owner HOSIDEN CORP