Production of flexible printing circuit board

A production method and flexible printing technology, which is applied in the direction of printed circuit manufacturing, printed circuit, electrical components, etc., can solve the problems of waste of working hours and materials, and the lack of mutual utilization, so as to shorten the production cycle, shorten the operation process, and reduce the working hours. Effect

Active Publication Date: 2007-06-20
靖江德方科技服务有限公司
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  • Summary
  • Abstract
  • Description
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AI Technical Summary

Problems solved by technology

In the layout and wiring step, the length of the conductive wire is generally set to be 0.8 mm to 1.0 mm. Before the O / S test, in order to meet the test requirements of the FPC internal circuit and the external copper surface open circuit, the entire product needs to be cut into pieces. Strips, and then use the steel mold to punch the conductive wire to punch it off. The above cutting and punching steps are not combined with each other, resulting in waste of man-hours and materials.

Method used

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  • Production of flexible printing circuit board

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Effect test

Embodiment Construction

[0017] The manufacturing method of the flexible printed circuit board as shown in the accompanying drawing comprises the following steps carried out in sequence:

[0018] Typesetting and wiring: First, intersect the conductive wires used at the upper and lower FPC contacts to be made on the same plane. Connect, then typesetting horizontally, and make negatives after completion;

[0019] Cutting: Cut the entire roll of copper foil material LVAS1018RD and cover film material CVA1025 into sheet materials with a size of 250mm×335mm;

[0020] Film attachment: Paste the photosensitive dry film H-S930 with a film thickness of 30 μm on the surface of a single copper foil. Let stand for at least 15 minutes after pressing;

[0021] Exposure: Place the produced negative film on the photosensitive dry film, vacuumize for 10s, and the vacuum degree is above 90%, so that the negative film and the photosensitive dry film are closely attached, and then irradiate the negative film with 40Mj ...

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Abstract

The method comprises: layout and wiring; cutting off; coating film; exposure; developing; etching; stripping film; covering tectorial membrane by hot press; surface treating; making location holes; cutting up into pieces. The layout and wiring step comprises: two wires to be located at the joint of flexible printed circuit (FPC) are crossed each other on same plane, and then are connected to the ground copper; making layout and wiring. The step of making location hole comprises: location holes are made at place exposed after etching. The step next to the step of cutting up into pieces comprises: testing and packaging the product.

Description

technical field [0001] The present invention relates to a connecting device for a flexible printed circuit or a flat or ribbon cable, in particular to a method for manufacturing a flexible printed circuit board. Background technique [0002] The existing single-sided flexible printed circuit board (Flexible Printed Circuit board, FPC for short) manufacturing method has the following steps in sequence: typesetting and wiring, cutting, film attachment, exposure, imaging, etching, film removal, covering film hot pressing, surface Processing, punching positioning holes (including punching positioning holes for punching conductive wires and positioning holes for punching appearance), cutting into strips, punching conductive wires, O / S test (open & short test, open circuit, short circuit electrical performance Test), die-cut FPC products whose appearance meets the design requirements and inspection packaging. The surface is gold-plated, which can meet the requirements of hardness...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/02H05K13/06
Inventor 梅晓波
Owner 靖江德方科技服务有限公司
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