Packaging structure of chip with slot type metallic film supporting wire bonding
A technology of chip packaging and construction, applied in electrical components, electric solid state devices, circuits, etc., can solve problems such as inconvenience and lack of structure in products
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[0070] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the following is a detailed description of the packaging structure of the slotted metal film carrying the wire-bonded chip proposed according to the present invention in conjunction with the accompanying drawings and preferred embodiments. Embodiments, structures, features and effects thereof are described in detail below.
[0071] Through the description of the specific implementation mode, when the technical means and functions adopted by the present invention to achieve the predetermined purpose can be obtained a deeper and more specific understanding, but the accompanying drawings are only for reference and description, and are not used to explain the present invention be restricted.
[0072] A specific embodiment of the present invention discloses a packaging structure in which a slotted metal film is used to support a wire-bonded c...
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