Packaging structure of chip with slot type metallic film supporting wire bonding

Abstract

This invention relates to a packaging structure which using slotted metal film bearing fight line chip, and it uses a slotted metal film substrate bearing a fight line chip and chip-on-board packaging pattern, in which the slot can provide the weld wire and electrical connect the chip and the film substrate. The film substrate includes a pictorial metal core layer and at least one surface dielectric layer, and the pictorial metal core layer has the plural media and the plural external-connected pads, in which the media arranged around the slot. When the active surface of the chip attached to the film substrate, it can be very close to the pictorial metal core layer, and the pictorial metal core layer will provide good chip cooling path. Moreover, the chip package structure of the film substrate can reduce substrate costs and the thickness of the whole package, and enhance the effectiveness of thermal stress resistance.

Description

technical field [0001] The invention relates to a package structure of a chip, in particular to a chip-on-board (COB) type package structure in which a slotted metal film is used to carry a bonded chip. Background technique [0002] Chip-On-Board (COB) packaging is currently a common method in integrated circuit packaging. COB packaging mainly includes three processes: (1) the chip is directly attached to the slotted substrate, (2) the wire is electrically connected through the slot of the substrate, and (3) the chip is sealed with glue, so as to mass produce high-speed computing chips. Integrated circuit chips, especially solder balls are connected to form a ball grid array package (BGA package). It is known that the current memory chip package has developed into a COB structure to replace the previous Thin Small Outline Package (TSOP) ) and solve the dilemma that the speed cannot be increased. [0003] As shown in FIG. 1 , a conventional COB type chip packaging structure...

AI Technical Summary

Problems solved by technology

[0005] It can be seen that the above-mentioned existing chip packaging structure obviously still has inconvenience and defects in structure and use, and needs to be further improved urgently.

In order to solve the problems existing in the packaging structure of the chip, the releva

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