Method for manufacturing white light diode with low attenuation

Abstract

This invention relates to the white light diode manufacturing method; it includes the standing, the packaging epoxy resin, the supporting cup, and others, the processing steps as following: a. within the supporting cup, implant the bonding material; b. place the luminous material above the bonding material of the supporting cup, and fix it with the standing together; c. roast to dry the bonding material; d. use the gold line connecting with the electrode of the luminescent material and the pin of the standing; e. use the epoxy resin to package, which form a fluorescent material bowl above the supporting cup; f. plate the reflective material at the bowl wall; g. in the bowl, fire the fluorescent material; h. dry the fluorescent material; i. package to the required shape; there is gap between the bowl and the supporting cup, and the gap is filled by the epoxy resin; due to the separation of the phosphor powder and the luminescent material, the heat generated by the luminous material does not cause the decay of the phosphor powder and improves the diode life; meanwhile, no phosphor powder in the luminescent material side, it reduces the phosphor powder scattering which can cause downward light, thereby improving the efficiency of light out.

Description

Technical field: [0001] The invention relates to a method for manufacturing a semiconductor device, especially a method for manufacturing a low-attenuation white light diode. Background technique: [0002] There are many kinds of white light-emitting diodes (light-emitting diodes), and blue light, purple light or ultraviolet light are commonly used to excite RGB (red, green and blue) fluorescent substances to obtain white light, such as blue light-emitting materials plus YAG (yttrium aluminum garnet) fluorescent substances For example, a "surface-mounted white light-emitting diode" disclosed in Chinese patent application 200310120736, "a high-brightness nitride light-emitting diode and its preparation method" disclosed in Chinese patent ZL 02100345, and the disclosed in Chinese patent application 01141509 "A Fabrication Method for White Light Emitting Diodes". [0003] In the actual production process of the above-mentioned known branches, the fluorescent substance is usual...

AI Technical Summary

Problems solved by technology

[0003] In the actual production process of the above-mentioned known branches, the fluorescent substance is usually prepared into a liquid state, and the fluorescent substance is added to the luminescent material to cover the luminescent material. The disadvantages are: 1. The precipitation of the fluorescent substance is difficult to control uniformly, and it is easy to flow The spot effect of the finished light-emitting diode is not good, and the consistency is not good in mass production. 2. Most of the fluorescent substances are deposited under the side of the luminescent material, which does not contribute to the light emission, causing serious waste; 3. The fluorescent substance is directly mixed with When the luminescent material is in contact, the heat emitted by the luminescent material causes a large attenuation of the fluorescent material, thus shortening the service life

How to form a uniform fluorescent substance coating around the luminescent material to produce a white light diode with uniform and consistent light emission, and minimize the amount of fluorescent substance used and simplify the curing process of the fluorescent substance adhesive film to reduce production costs. Technology does not provide a good solution

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