Heat radiator
a radiator and heat sink technology, applied in the field of heat sinks, can solve the problems that the above-described heat sinks are not suitable for the use of high-pressure refrigerants, and achieve the effects of reducing the load applied, reducing the flatness, and reducing the strength of the heat absorption elemen
Inactive Publication Date: 2005-01-27
PANASONIC CORP
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Benefits of technology
"The present invention provides a heat radiator that is suitable for high-pressure refrigerants. The heat radiator includes a heat absorbing element, a heat radiating element, and a pump connected between them to form a closed circuit. The heat absorbing element has a heat-exchanging portion, a cover, and a connecting member that connects the heat-exchanging portion and the cover. The presence of the connecting member reduces the surface area of the heat-exchanging portion and the cover, which prevents the surface from becoming uneven when exposed to the high-pressure refrigerant. The cover is joined to the heat-exchanging portion using a brazing filler material, which maintains the strength of the heat absorbing element without deforming its surface."
Problems solved by technology
However, the heat radiator of the above-described construction is not suited to the use of a high-pressure refrigerant such as a fluorocarbon-based refrigerant, a latent heat effect of which is effectively utilized to further reduce the heat resistance to enhance the heat radiating performance.
Method used
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[0017] This application is based on an application No. 2003-277384 filed Jul. 22, 2003 in Japan, the content of which is herein expressly incorporated by reference in its entirety.
[0018] Referring now to the drawings, there is shown in FIG. 2 a circuit diagram of a heat radiator R embodying the present invention. The heat radiator R shown in FIG. 2 includes a heat absorbing element 2, a heat radiating element 4, and a pump 6, all connected in series via piping 8 to define a closed circuit. A high-pressure refrigerant filled in this closed circuit circulates through the heat absorbing element 2, the heat radiating element 4, and the pump 6 in this order.
[0019]FIG. 3A depicts the heat absorbing element 2 partly in section, and FIG. 3B is a section taken along line A-A in FIG. 3A.
[0020] As shown in FIG. 3A, the heat absorbing element 2 confronts and is attached fast to a heating element 10 such as, for example, a semiconductor element mounted in an electronic appliance such as, for ...
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A heat radiator includes a heat absorbing element, a heat radiating element, and a pump connected with the heat absorbing element and the heat radiating element to define a closed circuit. The pump circulates a refrigerant through the closed circuit. The heat absorbing element includes a heat-exchanging portion for transferring heat generated by a heating element to the refrigerant, a cover joined to a peripheral edge of the heat-exchanging portion to define a refrigerant flow channel therebetween, and one or more connecting members disposed within the refrigerant flow channel and having opposite ends joined to the heat-exchanging portion and the cover, respectively, to connect the heat-exchanging portion and the cover with each other.
Description
BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a heat radiator for radiating heat from a heating element such as a semiconductor element mounted in an electronic appliance such as a computer or the like. [0003] 2. Description of the Related Art [0004] Japanese Laid-Open Patent Publication No. 2001-24372 discloses a conventional heat radiator, which is mounted in a notebook computer to radiate heat from a heating element in the computer. [0005] As shown in FIG. 1, the heat radiator in the computer 50 includes a heat absorbing element 52 attached fast to a heating element 54 mounted in the computer 50, a pump 56 fluid connected to the heat absorbing element 52, and a heat radiating element 58 fluid connected to the heat absorbing element 52 and the pump 56, all connected in series to define a refrigerant circulating cycle. A typical refrigerant employed in this refrigerant circulating cycle is an easy-to-handle water-based one, and...
Claims
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IPC IPC(8): H01L23/473F25D9/00H05K7/20
CPCF28D2021/0029H01L23/473H01L2924/0002H01L2924/00
Inventor ASHITANI, HIROMASANAKANO, MASAOTSUJIMOTO, TSUTOMU
Owner PANASONIC CORP