Damper system for transportation

Abstract

A damper system for transportation includes a packaging box for storing a container containing a work and also includes a pair of an upper damper and a lower damper each placed between the packaging box and the container. The upper and lower dampers contain foamed polyethylene or polypropylene, the upper damper includes upper impact-absorbing sections, and the lower damper includes lower impact-absorbing sections. The sum of h2 and h1 is equal to the width of an upper or lower space between the packaging box and the container, and h1 is greater than h2, wherein h2 represents the height of the upper impact-absorbing sections and h1 represents the height of the lower impact-absorbing sections. The shape of the upper and lower impact-absorbing sections is rectangular parallelepiped shape.

Description

CROSS-REFERENCE TO RELATED APPLICATION [0001] This application claims, under 35 USC 119, priority of Japanese Application No. 2003-200935 filed Jul. 24, 2003. BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to packaging systems for transporting containers principally storing circular works such as semiconductor wafers or magnetic disks. The present invention particularly relates to a damper system for transportation. The damper system includes a packaging box, such as a corrugated fiberboard box, for storing a container containing a work and also includes a pair of upper and lower dampers placed between the container and the packaging box. The dampers absorb impact applied from outside, whereby the container and the work placed therein are prevented from being damaged. [0004] 2. Description of the Related Art [0005]FIG. 4 shows a known damper system for transporting semiconductor wafers or recording disks. The known damper system inc...

AI Technical Summary

Benefits of technology

"The present invention provides a damper system for transporting semiconductor wafers or other products. The system includes a packaging box and a pair of upper and lower dampers placed between the packaging box and the container. The dampers contain foamed polyethylene or polypropylene and are designed to absorb impact and protect the product from damage during transportation. The lower dagger has a rectangular parallelepiped shape and is placed at the center of the packaging box to distribute impact. The percentage of Sb to Sa is within a range of 3% to 5% to ensure effective absorption of impact. The upper and lower impact-absorbing sections have a uniform distortion when subjected to strong impact, resulting in efficient absorption of impact. The lower damper has an opening located at the center to minimize contact area and prevent damage to the container and the semiconductor wafers. The percentage of Sb to Sa is preferably within a range of 3% to 5% to ensure effective absorption of impact."

Problems solved by technology

Those materials can be readily distorted by impact and cannot be readily restored to their former state; hence, the lower and upper dampers 2 and 3, once distorted, cannot absorb impact continuously applied thereto.

However, the shipping box is not suitable for practical use because the usage cost is high unless the box is fully reused.

However, the bellows has an insufficient ability to absorb impact and cannot therefore be used for transporting the 300 mm wafers.

In general, molded plastic sheets and laminated corrugated fiberboards used in known techniques have low resilience.

Therefore, once the sheets and the fiberboards receive a strong impact, they are distorted and cannot function as dampers.

However, in the dampers, there is a problem in that poisonous gas is generated when the dampers discarded are burned.

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