Counter-stream-mode oscillating-flow heat transport apparatus

a heat transport apparatus and counter-stream mode technology, applied in lighting and heating apparatus, cooling/ventilation/heating modification, semiconductor devices, etc., can solve the problems of heat transport capability decline and heat transport capacity decrease, and achieve the effect of preventing heat transport capability degradation

Inactive Publication Date: 2005-02-03
DENSO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0013] The present invention was developed in view of the aforementioned problems. It is therefore a first object of the invention to provide a new counter-stream-mode oscillating-flow heat transport apparatus that is different from

Problems solved by technology

On the other hand, when a decrease in volume of the liquid, due to a decrease in temperature, reduces the pressure in the heat transport device, the decrease in pressure results in a gas being produced in the heat transport device.
The resulting gas absorbs oscillatory movement in the liquid to reduce the amplitude of the oscillatory movement in the liquid, thereby causing a decrease in heat transport capability.
However, since liquid (pressure) oscillations occur everywhere in the flow path, an

Method used

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  • Counter-stream-mode oscillating-flow heat transport apparatus

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Experimental program
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first embodiment

[0059] [First Embodiment]

[0060] This embodiment is implemented by the present invention being applied to a cooling device for use with electronic components. FIG. 1 is a schematic view showing a counter-stream-mode oscillating-flow heat transport apparatus 1 according to this embodiment. FIG. 2 is a partially enlarged cross-sectional view showing a buffer tank 6.

[0061] Referring to FIG. 1, a heat transport device assembly 2 formed generally in the shape of a swath of plate has meandering flow paths 3 filled with a liquid, and includes a target to be cooled or a heating element (not shown) with a heat source on a plate face generally at a longitudinal end (at the upper end in the figure). The configuration of the heat transport device assembly 2 will be described later.

[0062] In this embodiment, the heating element is intended to represent electronic components such as integrated circuits for use in computers. The heat transport device assembly 2 is also provided with a heat sink (...

second embodiment

[0076] [Second Embodiment]

[0077] In the first embodiment, the space in the bellows 6b was employed as the liquid tank chamber 6a. However, as shown in FIG. 3, this embodiment is adapted such that the buffer tank 6 includes a liquid tank chamber 6a filled with a liquid and a gas tank chamber 6d filled with a gas. Also employed is a bellows 6b, which is elastically deformable and displaceable, as a partition for defining the liquid tank chamber 6a and the gas tank chamber 6d.

[0078] In this second embodiment, the space defined by the bellows 6b and a cylindrical housing 6e serves as the liquid tank chamber 6a, while the space in the bellows 6b serves as the gas tank chamber 6d. Since the gas tank chamber 6d is a closed space in this embodiment, a gas to be sealed in the gas tank chamber 6d is preferably an inert gas such as nitrogen. However, to provide a hole 6h for the gas tank chamber 6d to define an open space, the buffer tank 6 is configured substantially in the same manner as in...

third embodiment

[0079] [Third Embodiment]

[0080] This embodiment is a modified example of the second embodiment. More specifically, as shown in FIG. 4, a partitioning member for defining the liquid tank chamber 6a and the gas tank chamber 6d is a thin-film bag-shaped member 6f made of an elastic material such as rubber. In this embodiment, the space defined by the bag-shaped member 6f and the housing 6e serves as the liquid tank chamber 6a, while the closed space in the bag-shaped member 6f serves as the gas tank chamber 6d.

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Abstract

A counter-stream-mode oscillating-flow heat transport apparatus accommodates a change in volume of a liquid while preventing reduction in heat transport capability. A flow path and a buffer tank are placed in communication with each other via a throttle such as a capillary tube. This prevents a channel connecting the flow path and the buffer tank from having an excessively reduced channel resistance (flow path resistance). This prevents the fluid in a heat transport device assembly (the flow path) from only going back and forth between the heat transport device assembly and the buffer tank without experiencing liquid (pressure) oscillations in the heat transport device assembly. Accordingly, the liquid in the heat transport device assembly is prevented from being reduced in amplitude of oscillation, thereby preventing degradation in heat transport capability of the counter-stream-mode oscillating-flow heat transport apparatus.

Description

CROSS REFERENCE TO RELATED APPLICATIONS [0001] This application is based upon, claims the benefit of priority of, and incorporates by reference Japanese Patent Applications No. 2003-167746 filed Jun. 12, 2003, No. 2003-356304 filed Oct. 16, 2003, and No. 2004-118910 filed Apr. 14, 2004. BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to a counter-stream-mode oscillating-flow heat transport apparatus that induces oscillatory movement in a liquid flowing in opposite directions through adjacent flow paths to transfer heat therebetween and thereby transport heat from a hot area to a cold area. The apparatus is effectively applicable to thermal-quasi-superconductive plates, thermal switches, thermal diodes, and the like. [0004] 2. Description of the Related Art [0005] The counter-stream-mode oscillating-flow heat transport apparatus utilizes the enhanced diffusion effect provided by oscillatory movement in a fluid flow based on the follow...

Claims

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Application Information

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IPC IPC(8): F28D15/00F28D15/02F28D15/06F28F13/10H01L23/473H05K7/20
CPCF28D15/0233F28D15/06F28F13/10H01L23/473H01L2924/0002H01L2924/00
Inventor KOHARA, KIMIOINOUE, SEIJINARA, KENICHIFUJIKI, KOJIOKA, KATSUHIKONAGANAWA, TOMOKI
Owner DENSO CORP
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