Method of detecting and classifying scratches, particles and pits on thin film disks or wafers

a thin film disk and particle technology, applied in the field of thin, can solve the problems of failure of a hard disk, high cost, and inability to retrieve data,

Inactive Publication Date: 2005-03-17
MEEKS STEVEN W
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0011] A method is provided for categorizing defects, such as scratches, particles, and pits, on the surface of an object. Two or more light beams with different planes of incidence, such as orthogonally oriented beams, are directed at the surface of the object. The scattered light...

Problems solved by technology

One problem that the manufacturers of hard disks experience is how to maximize the operating life of a hard disk.
When a hard disk fails the data stored therein may be difficult, expensive, or impossible to retrieve.
Failure of a hard disk may be caused by defects on the surface of the thin film disk.
As a result even very small defects can cause a hard drive to fail.
The problem is that the CMP process can leave residual copper, nitride, or CMP slurry on the surface of the wafer.
In addition, stains, particles, scratches, and micro-waviness may be p...

Method used

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  • Method of detecting and classifying scratches, particles and pits on thin film disks or wafers
  • Method of detecting and classifying scratches, particles and pits on thin film disks or wafers
  • Method of detecting and classifying scratches, particles and pits on thin film disks or wafers

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Embodiment Construction

[0054] A preferred embodiment of the present invention is now described with reference to the figures where like reference numbers indicate identical or functionally similar elements. Also in the figures, the left most digit(s) of each reference number correspond(s) to the figure in which the reference number is first used.

[0055]FIG. 3 is an illustration of an apparatus for measuring properties of the thin film according to an embodiment of the present invention. The apparatus uses a focused laser light signal whose angle of propagation 0 (as shown in FIG. 3) can be between zero degrees from normal and ninety degrees from normal.

[0056] One embodiment of the apparatus 300 includes a conventional laser diode 301, e.g., RLD65MZT1 or RLD-78MD available from Rolm Corporation, Kyoto, Japan, which has been collimated by Hoetron Corp., Sunnyvale, Calif., e.g., a conventional linear polarizer 302, e.g., made of Polarcor that is commercially available from Newport Corp., Irvine, Calif., a c...

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PUM

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Abstract

Scratches, pits and particles which are smaller or larger than the beam size may be measured and identified by a dual beam technique. This invention uses a pair of orthogonally oriented laser beams, one in the radial and one in the circumferential direction. The scattered light from radial and circumferential beams allows the detection and classification of particles, pits and scratches.

Description

RELATED APPLICATIONS [0001] This application is a continuation of U.S. patent application Ser. No. 10 / 219,632, filed on Aug. 14, 2002 (applicants reference number 20830-07089), which is a continuation-in-part of U.S. patent application Ser. No. 10 / 126,154, filed on Apr. 19, 2002 (applicants reference number 6820), which is a continuation-in-part of U.S. patent application Ser. No. 10 / 029,957, filed on Dec. 21, 2001 (applicants reference number 6581), which is a continuation-in-part of U.S. patent application Ser. No. 09 / 861,280, filed on May 18, 2001 (applicants reference number 6056), which is a continuation of U.S. patent application Ser. No. 09 / 818,199, filed on Mar. 26, 2001 (applicants reference number 5727), which are all incorporated by reference herein in their entirety. [0002] This application is also related to U.S. patent application Ser. No. 09 / 718,054 filed on 20 Nov. 2000 (applicants reference number 5534), which is a continuation-in-part of U.S. patent application Ser...

Claims

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Application Information

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IPC IPC(8): G01B11/06G01B11/30H01L21/66
CPCG01B11/0616H01L22/12G01B11/306G01B11/0641
Inventor MEEKS, STEVEN W.
Owner MEEKS STEVEN W
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