Endpoint compensation in electroprocessing

a technology of electroprocessing and endpoint compensation, which is applied in the direction of manufacturing tools, lapping machines, electric circuits machining, etc., can solve the problems of time-consuming methods, impede the accurate determination of the polishing endpoint, and the progress of the polishing operation is not easily viewabl
US20050061674A1Inactive Publication Date: 2005-03-24APPLIED MATERIALS INC
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Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
APPLIED MATERIALS INC
Publication Date
2005-03-24
Estimated Expiration
Not applicable · inactive patent

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Abstract

Method for process control of electro-processes is provided. In one embodiment, the method includes processing a conductive layer formed on a wafer using a target endpoint, detecting breakthrough of the conductive layer to expose portions of an underlying layer, and adjusting the target endpoint in response to the detected breakthrough. In another embodiment, the target endpoint is adjusted relative to an amount of underlying layer exposed through the conductive layer.
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Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention generally relates to polishing, planarization, plating and combinations thereof. More particularly, the invention relates to the monitoring and control of electro-processing, polishing and plating. 2. Description of the Related Art Sub-quarter micron multi-level metallization is one of the key technologies for the next generation of ultra large-scale integration (ULSI). The multilevel interconnects that lie at the heart of this technology require planarization of interconnect features formed in high aspect ratio apertures, including contacts, vias, trenches and other features. Reliable formation of these interconnect features is very important to the success of ULSI and to the continued effort to increase circuit density and quality on individual wafers and die. In the fabrication of integrated circuits and other electronic devices, multiple layers of conducting, semiconducting, and dielectric materials...

Claims

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