Ceramic multilayer substrate and method for manufacturing the same

Abstract

A ceramic multilayer substrate is formed by vertically stacking and firing a plurality of ceramic sheets, in which a connection bar is vertically formed between internal patterns and an external terminal of each ceramic sheet, preventing metallic conductive layers of the internal patterns from being deformed during processing the external terminal. The ceramic multilayer substrate has pattern layers formed on surfaces of at least some of the ceramic sheets. At least one through hole is formed on the edges of the stacked ceramic sheets so as to be opened to the outside. An external terminal is formed on an inner wall of the through hole connected with the pattern layers, and directly contacting the connection bar, whereby the connection bar supports the electrical connection between the external terminal and the pattern layers.

Description

RELATED APPLICATIONS [0001] The referenced application is a divisional of U.S. patent application Ser. No. 10 / 340,590, filed Jan. 13, 2003.BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to a ceramic multilayer substrate with an improved connection structure between internal patterns and an external terminal, and a method for manufacturing the substrate, and more particularly to a low temperature co-fired ceramic multilayer substrate formed by vertically stacking and firing a plurality of ceramic sheets or layers, in which a connection bar is vertically formed on connection areas between internal patterns and an external terminal of each ceramic sheet, thereby preventing metallic conductive layers of the internal patterns from being deformed during the formation of the external terminal and stably connecting the internal patterns to the external terminal, and a method for manufacturing the substrate. [0004] 2. Description of the Rela...

AI Technical Summary

Benefits of technology

"The present invention provides a ceramic multilayer substrate that simplifies the manufacturing process and improves quality. The substrate has a plurality of ceramic green sheets stacked vertically with pattern layers formed on surfaces of at least one of the sheets. A through hole is formed in the substrate to expose the pattern layers and an external terminal is formed in the through hole by deposition. The substrate is formed by stacking and firing the ceramic sheets. The invention also provides a method for manufacturing the substrate and a stack structure formed by stacking a plurality of layers. The technical effects of the invention include simplifying the manufacturing process, improving quality, and providing a more reliable and efficient method for connecting the internal and external terminals."

Problems solved by technology

However, the above Japanese Publication has a problem as follows.

However, the Japanese Publication as shown in FIGS. 1 and 2 does not solve the above-described problem.

Therefore, this method complicates a manufacturing process of the substrate and does not satisfy a requirement for mass production.

In this case, since the external electrodes 4b must be respectively formed on the ceramic substrates, the manufacturing process is very complicated.

Further, since the dimensions of all the substrates are not uniform due to the difference of contraction ratios between individual substrates, the ceramic multilayer substrate is easily damaged by an external impact, or etc.

As shown in FIG. 6, since the notches of the ceramic multilayer substrate 3 are not precisely aligned with each other, a material for forming the external electrodes is not uniformly deposited in every notch and the connection between the internal patterns and the external electrode becomes poor.

In this case, as described in FIG. 3, internal patterns 2d are not exposed in the notch in a step for forming the notch, thereby causing the same problem of not being connected to the external electrode 4d.

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