Device for processing a three dimensional structure into a substrate

a three-dimensional structure and substrate technology, applied in the field of devices and processes for processing substrates, can solve the problems of needing to renew or renovate the cutting edge of the tool, the cost of making the mould is relatively high, and the process is relatively expensiv
US20050155403A1Inactive Publication Date: 2005-07-21GLUD & MARSTRAND
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Patent Information

Authority / Receiving Office
US Β· United States
Current Assignee / Owner
GLUD & MARSTRAND
Publication Date
2005-07-21
Estimated Expiration
Not applicable Β· inactive patent

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Abstract

A device and method for processing a substrate, wherein a flexible force absorbing means is provide in at least a part of a tool plan and / or a reaction plan, so as to locally absorbing the forces applied by the planes. The flexible force absorbing mean having spring-like properties such that it is adapted to be elastically deformed when the tool plan and the reaction plan are pressed against each other.
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Description

FIELD OF THE INVENTION

[0001] This invention relates generally to a device and a process for processing a substrate, e.g. forming a three-dimensional structure, nanostructure, hologram or similar relief diffraction pattern into a substrate by use of a re-configurable mould. BACKGROUND OF THE INVENTION

[0002] Various techniques for cutting and forming a substrate exist. Cutting is done in different ways e.g. punching. Normally the cutting machine is provided with co-operating edges used to cut the material. Especially when cutting fine geometry's where allowable variations in the tolerances are relatively small, the tool with the cutting edges need to be renewed or renovated often, due to tear and ware of the tool. This makes the process relatively expensive.

[0003] Various casting techniques for forming microstructure surfaces exist. Typically a mould holds a liquid resin on the substrate during curing of the resin whereby the resin forms the microstructure. The mould may be provide...

Claims

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