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Benefits of technology
[0022] However, the confluence of all three of the established major trends summarized above--supercomputer-like personal computers, the spread of parallel processing using personal computer general purpose microprocessors (particularly massively parallel processing), and the enormous increase in network communi
Problems solved by technology
Despite these tremendous improvements anticipated in the future, a typical PC is already so fast that its microprocessor is essentially idle during most of the time the PC is in actual use, and the operating time itself is but a small fraction of those days the PC is even in use at all.
Nearly all PC's are essentially idle during roughly all of their useful life.
Because the reliability of PC's is so exceptionally high now, with the mean time to failure of all components typically several hundred thousand hours or more, the huge idle time of PC's represents a total loss; given the h
Method used
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Embodiment Construction
[0063] Embodiments useful for a network of computers are presented. In an embodiment, an apparatus includes a microchip and a Faraday Cage. The microchip includes a personal computer with a general purpose microprocessor on the microchip. The Faraday Cage surrounds at least a portion of the microchip. In another embodiment, an apparatus includes a microchip. The microchip includes a general purpose microprocessor and one or more photovoltaic cells.
[0064] The new network computer utilizes PC's as providers of computing power to the network, not just users of network services. These connections between network and personal computer are enabled by a new form of computer / network financial structure that is rooted in the fact that economic resources being provided the network by PC owners (or leaser) are similar in value to those being provided by the network provider providing connectivity.
[0065] Unlike existing one-way functional relationships between PC users and network providers s...
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Abstract
Embodiments useful for a network of computers are presented. In an embodiment, a microchip includes a plurality of dies. Each die is made by a separate fabrication process and assembled into a package with the separate die sections connected directly.
Description
[0001] This application receives the benefit of provisional application 60 / 418,177, filed Oct. 15, 2002. This application is a continuation-in-part of International Application No. PCT / US02 / 29227, filed Sep. 16, 2002, which in turn claims the benefit of U.S. Provisional Application Nos. 60 / 322,474, filed Sep. 17, 2001, and 60 / 323,701, filed Sep. 21, 2001. This application is also a continuation-in-part of U.S. patent application Ser. No. 09 / 935,779, filed Aug. 24, 2001, which receives the benefit of priority from provisional applications 60 / 308,826, filed Aug. 1, 2001, and 60 / 227,660, filed Aug. 25, 2000. U.S. patent application Ser. No. 09 / 935,779 is a continuation-in-part of U.S. patent application Ser. No. 09 / 571,558, filed May 16, 2000, which receives the benefit of priority from provisional applications 60 / 134,552, filed May 17, 1999, 60 / 135,851, filed May 24, 1999, 60 / 136,759, filed May 28, 1999, and 60 / 135,852, filed May 24, 1999. U.S. patent application Ser. No. 09 / 935,779 i...
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Application Information
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