Sputtering device

Abstract

The object of the invention is to provide a sputtering device which can design uniformity of film thickness distribution by corresponding to ablation change of a target and can gain a stable film quality by uniformity of film growth components. Accordingly, a sputtering device according to this invention comprises at least: a vacuum container defining a vacuum space; a substrate holder for holding a substrate in said vacuum container; at least one sputtering cathode device which is provided with a cathode unit located at a position facing said substrate held on the substrate holder and arranged slantly at a specific angle to said substrate, and a means for moving cathode unit in parallel along said substrate; and a target installed on said cathode unit. The plural sputtering cathode devices can be also arranged at specific intervals in a circumferential direction of the substrate holder.

Description

BACKGROUND OF THE INVENTION [0001] This invention relates to a sputtering device comprising at least a vacuum container defining a vacuum space, a substrate holder holding a substrate in the vacuum container, a cathode located at a position facing to the substrate held on the substrate holder, and a target installed on the cathode. [0002] An ion beam sputter device disclosed in JP 2002-212724 A is provided with a vacuum container forming a space for processing a film formed object in the vacuum atmosphere, a plurality of ion sources for radiating ion beam to the vacuum container, a holder which is arranged within a movement area where every movement area of sputtering particles radiated from every target by radiation of the ion beam from every ion source are moved is overlapped and holds the film formed object, a shutter movably located in the vacuum container and preventing the sputtering particles from movement to the film formed object's side when it is positioned within a moveme...

AI Technical Summary

Benefits of technology

[0006] The object of the invention is to provide a sputtering device which can design uniformity of film thickness distribution by corresponding to ablation change of a target and can gain a stable film quality by uniformity of film growth components.

[0010] Besides, the targets installed on the sputtering cathode units in the sputtering cathode devices consist of a same material. Accordingly, workability can be increased.

[0012] According to this invention, a cathode with a target is slanted to a rotating substrate and is moved along the substrate, so that a size of the target can be set no more than one of the substrate to achieve a decrease in costs, and a yield rate of the substrate can be increased because film thickness and film quality of the substrate is uniformed.

Problems solved by technology

Therefore, in JP 2003-247065 A discloses that the substrate table is moved up and down while rotated, but a mechanism for rotating and moving up / down the substrate table is complicated, as a result, disadvantage such that the costs are increased is arisen.

Accordingly, disadvantage for a film thickness distribution and a film growth is tried to be resolved by making a size of the cathode larger than the substrate (about 1.4 times) and by limiting activity ratio of the target, it becomes a cause of an increase in costs to enlarge the target and limitation of the activity ratio.

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