Illumination system for a microlithography projection exposure apparatus
a technology of exposure apparatus and exposure system, which is applied in the direction of microlithography exposure apparatus, printers, instruments, etc., can solve the problems of substantially codetermination between image quality and wafer throughput that can be achieved with the apparatus, and achieve the effect of small coheren
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[0039]FIG. 1 shows an example of an illumination system 1 of a microlithographic projection exposure apparatus which can be used in the fabrication of semiconductor components and other finely patterned devices and operates with light from the deep ultraviolet range in order to obtain resolutions down to fractions of micrometers. The light source 2 used is an F2 excimer laser having an operating wavelength of approximately 157 nm, the light beam of which is oriented coaxially with respect to the optical axis 3 of the illumination system. Other UV light sources, for example ArF excimer lasers having an operating wavelength of 193 nm, KrF excimer lasers having an operating wavelength of 248 nm or mercury vapor lamps having an operating wavelength of 368 nm or 436 nm or light sources having wavelengths of less than 157 nm are likewise possible.
[0040] The light from the light source 2 firstly enters a beam expander 4, which may be designed for example as a mirror arrangement in accorda...
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