Ball grid array IC substrate with over voltage protection function
a technology of over voltage protection and ic substrate, which is applied in the direction of thin film varistors, varistors, electrical devices, etc., can solve the problems of high design cost, limited space, and inability to recover damage to the ic devi
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Benefits of technology
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0026] The embodiments of the present invention are described with reference to the drawings. The same elements in the drawings have the same reference numerals.
[0027]FIGS. 2a, 2b and 2c are sectional views of an IC substrate formed with over voltage protection functions according to an embodiment of the present invention. As shown in FIG. 2a, a first conductor layer is formed to be a grounding conductor layer (23) on a substrate (22). The first conductor layer is formed on a lower surface of the substrate and extends through the substrate to its upper surface. One or more terminals are formed on the upper surface of the substrate. As shown in FIG. 2b, one or more variable resistance material layers (24) are formed to overlay the terminals of the grounding conductor layer (23) so as to form connection with each of the variable resistance material layers. In addition, a plurality of second conductor layers (21) are formed to be upper electrodes. The second conductor layers overlay o...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com