Substrate processing apparatus

Abstract

A substrate processing apparatus comprises an indexer block, an edge-cleaning processing block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, a cleaning / drying processing block and an interface block. An exposure device is arranged adjacent to the interface block of the substrate processing apparatus. In the exposure device, exposure processing is applied to a substrate by a liquid immersion method. In the edge-cleaning processing group in the edge-cleaning processing block, an edge of the substrate before exposure processing is cleaned.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a substrate processing apparatus for applying processing to substrates. [0003] 2. Description of the Background Art [0004] A substrate processing apparatus is used to apply a variety of processing to substrates such as semiconductor substrates, substrates for use in liquid crystal displays, plasma displays, optical disks, magnetic disks, magneto-optical disks, photomasks, and other substrates. [0005] Such a substrate processing apparatus typically applies a plurality of successive processing to a single substrate. The substrate processing apparatus as described in JP 2003-324139 A includes an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, and an interface block. An exposure device is arranged adjacent to the interface block as an external device separate from the substrate processing apparatus. [0006] In the ab...

AI Technical Summary

Benefits of technology

[0012] It is an object of the invention to provide a substrate processing apparatus capable of preventing contamination in an exposure device and avoiding a defective dimension and a defective shape of an exposure pattern.

Problems solved by technology

With such conventional exposure devices, however, the line width of an exposure pattern is determined by the wavelength of the light source of an exposure device, thus making it impossible to make a resist pattern finer than that.

Although a variety of film formation processing are applied to the substrate before the exposure processing, an edge of the substrate may be contaminated in the process of these film formation processing.

If the exposure processing is applied to the substrate with the edge of the substrate contaminated, a lens of the exposure device is contaminated, possibly generating a defective dimension and a defective shape of the exposure pattern.

Consequently, the lens of the exposure device may be contaminated, possibly generating a defective dimension and a defective shape of the exposure pattern.

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