Circuit board structure and method for fabricating the same
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[0036] The circuit board structure fabricated by the method demonstrated in the first embodiment comprises the dielectric layer 28 having a first surface 28a and a second surface 28b, a plurality of stacked heat sinks embedded in the dielectric layer 28 and exposed to the second surface 28b of the dielectric layer 28, the first circuit layer 25 embedded in the dielectric layer 28 and disposed evenly with the first surface 28a of the dielectric layer 28, and the second circuit layer 31 formed on the second surface 28b of the dielectric layer 28 and electrically conductive to the first circuit layer 25. The first circuit layer 25 is electrically conductive by the conductive via 280a formed in the dielectric layer 28 to the second circuit layer 31. The stacked heat sinks include the first heat sink 251 and the second heat sink 252 embedded in the dielectric layer 28, and third heat sink 253 exposed to the second surface 28b of the dielectric layer.
[0037] The first surface 28a of the d...
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